Design Signoff

Improve Design Robustness and Minimize Over-Pessimism in Face of Rising Variability

Detecting Electrical Hazards Incurred By Inter-Voltage Domain Crossing In Custom SRAMs

Synopsys and Samsung Collaborate to Deliver Fastest Design Closure and Signoff

Balancing Performance and Accuracy for Advanced Node Timing Signoff

Model Variation and its Impact on Cell Characterization

Lower Process Nodes Drive Timing Signoff Software Evolution

AI Requires a New Approach to Low Power Design

TSMC Timing Signoff in the Cloud with PrimeTime and StarRC

Synopsys’ New Platform Provides Deep Insights Throughout the Silicon Lifecycle

For AI Hardware, Power Optimization Starts With Software And Ends At Silicon

StarRC Density Corner Value Proposition

Digital Design Technology Symposium
On-Demand
A Virtual Experience

Functional ECO Techniques for Faster Design Cycle Closure

Reduce IR Drop Timing Risk in Silicon with a High-Fidelity Voltage-Timing Solution

Breakthrough Synopsys IC Validator Technologies Deliver Faster Physical Signoff Convergence

Optimize SoC Glitch Power with Accurate Analysis from RTL to Signoff

Lowering Tapeout Risks with Advanced Technology to Overcome Today’s ECO Closure Challenges

Static Timing Signoff and Model Generation for Complex AMS Designs

Advances in Timing Signoff to Address Today’s Design Challenges

Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design

Synopsys Helps Advance IBM's Vision for AI Compute Performance

TSMC Recognizes Synopsys Collaboration with Four OIP Partner of the Year Awards for IP and EDA Solutions

Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud

Making IC Test Faster and More Accessible, Part 1

Deployment of Formality at ViaSat with Lynx Integration