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Signoff
Unleashing the performance potential of advanced silicon process technology without the risk of design failure is one of the single biggest design closure challenges facing designers. Synopsys brings a broad integrated portfolio of state-of-the art design analysis and signoff technology all based on the golden signoff foundation customers have come to trust.
Accelerate Design Closure
Faster design closure, improved design performance, and more competitive chips. Synopsys design analysis and signoff solutions deliver all the ingredients necessary for the electrical and physical signoff of complex digital designs, with fewer iterations and more predictable development schedules.
From library generation with Composite Current Source (CCS) modeling to statistical timing analysis, advanced signal integrity, power analysis, and IR-drop-based analysis, Synopsys design analysis and signoff solutions accelerate innovation. Combining Synopsys signoff with IC Compiler™ II , Fusion Compiler, and RedHawk Analysis Fusion physical implementation solutions' tight correlation and ECO-closure integration allows designers to confidently realize the full performance potential with the fastest path to design closure.
NEW Native Automotive Solutions Optimize FuSa for ADAS and Autonomous Driving
NEW GF Qualifies Fusion Design Platform on 12LP FinFET Platform
Synopsys,/Arm/Samsung Accelerate Development of Arm "Hercules" Processor on 5LPE
PrimeECO Solution for Zero-Iteration Signoff-Driven Design Closure
Synopsys Introduces PrimeYield for 100X Faster SoC Yield Analysis and Optimization
Podcast