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Design Signoff
Unleashing the performance potential of advanced silicon process technology without the risk of design failure is one of the single biggest design closure challenges facing designers. Synopsys brings a broad integrated portfolio of state-of-the art design analysis and signoff technology all based on the golden signoff foundation customers have come to trust.
Webinar
Webinar
Accelerate Design Closure
Faster design closure, improved design performance, and more competitive chips. Synopsys design analysis and signoff solutions deliver all the ingredients necessary for the electrical and physical signoff of complex digital designs, with fewer iterations and more predictable development schedules.
From library generation with Composite Current Source (CCS) modeling to statistical timing analysis, advanced signal integrity, power analysis, and IR-drop-based analysis, Synopsys design analysis and signoff solutions accelerate innovation. Combining Synopsys signoff with IC Compiler™ II , Fusion Compiler, and RedHawk Analysis Fusion physical implementation solutions' tight correlation and ECO-closure integration allows designers to confidently realize the full performance potential with the fastest path to design closure.
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