PrimeTime SIG: Xcelerating Design-to-Silicon Closure

Next-Generation Distributed Static Timing Analysis On The Cloud

5X Faster Equivalence Checking with Formality ML-driven DPX

An Efficient Method to Perform Functional ECO Using Formality ECO

Overcoming The Growing Challenge Of Dynamic IR-Drop

Samsung Foundry Certifies PrimeLib Unified Library Solution at 5, 4 and 3nm Process Nodes

Samsung Foundry Adopts Voltage-Timing Signoff Solution from Synopsys & Ansys

PrimeShield Design Robustness Solution Recognized by 2021 World Electronics Achievement Awards

Improving Design Robustness and Efficiency with PrimeShield

PrimeLib Next-Generation Library Characterization Solution

Resistance Extraction with StarRC

TSMC Certification of SiliconSmart Library Characterization Solution at Advanced Process Nodes

Synopsys Introduces PrimeLib Unified Library Characterization and Validation Solution

Synopsys Digital and Custom Design Platforms Certified for TSMC’s Latest 3nm Process Technology

PrimeLib: Library Characterization and Validation for Accelerated Turnaround Time

PrimeShield Selected by Samsung Electronics to Maximize Efficiency & Performance for Next-Gen. Process Nodes

PrimeShield for Low-Power Design - Part 2

Comprehensive Real-Time Low-Power Equivalence Signoff Using Formality

Designer's Digest #23: Addressing Emerging Market and Customer Needs with PrimeTime

Synopsys and Samsung Collaborate to Deliver Fastest Design Closure and Signoff

Validating Memory Design Scan Chains from Behavioral to Transistor Level

Cell Library Verification Using Symbolic Simulation

Global Variation and Its Impact on Time-to-Market for Designs

Balancing Performance and Accuracy for Advanced Node Timing Signoff

Improve Design Robustness and Minimize Over-Pessimism in Face of Rising Variability

Reducing Glitch Power Waste in Advanced SoCs with a New Methodology

Accelerating Hyperconvergent IC Designs

Functional ECO Techniques for Faster Design Cycle Closure

Detecting Electrical Hazards Incurred By Inter-Voltage Domain Crossing In Custom SRAMs

Lower Process Nodes Drive Timing Signoff Software Evolution

Lowering Tapeout Risks with Advanced Technology to Overcome Today’s ECO Closure Challenges

StarRC Density Corner Value Proposition

TSMC Timing Signoff in the Cloud with PrimeTime and StarRC

Model Variation and its Impact on Cell Characterization

Reference Flow for Predictable Execution of ASIL D-Compliant SoC Design

Advances in Timing Signoff to Address Today’s Design Challenges