The semiconductor industry is experiencing a massive shift in chip design from monolithic SoCs to multi-die systems that integrate heterogeneous dies in a single package. Multi-die systems provide a path for designers to efficiently deliver innovative products with unprecedented functionality at a cost-effective price. By reusing proven dies, designers can reduce risk, accelerate time to market, and rapidly create new product variants with optimized system power and performance. Synopsys is leading the industry transformation from monolithic system-on-chips (SoCs) to multi-die systems with a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.