Multi-Die System Solution

Early and fast architecture exploration is at the heart of achieving multi-die system success. Design exploration and analysis for multi-die systems become more complex, going from one die to multiple dies in a package. Designers must efficiently explore the appropriate partitions and system-level interconnect fabric to realize best system performance for the target workloads. Reusing IP effectively to meet time-to-market and cost constraints, ensuring testability, and securing the multi-die system, are among some of the challenges that require fast and early analysis-driven exploration. Early architecture exploration and analysis for multi-die systems enables system designers to optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.

The ability to seamlessly transition your designs from monolithic SoC to multiple dies in a package becomes paramount in maintaining target PPA and time-to-market. Using a highly integrated and scalable co-design and analysis platform can help you manage the implementation complexity of 10s of dies to potentially hundreds of millions of interconnections. It allows you to efficiently explore, implement and analyze your multi-die systems. Having access to standards-compliant IP with critical latency, PPA, interoperability and security features that meet a broad range of multi-die system requirements provides the fastest path to assembling known good dies in an advanced package.