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Driving the Next Wave of Semiconductor Innovation
As a trusted partner, Synopsys is driving the industry transformation to multi-die designs with a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA and IP products, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design and optimization, robust die-to-die and chip-to-chip connectivity, and improved manufacturing and reliability.
What's New
Discover the latest resources for multi-die design success
Key Benefits
Early Architecture Exploration for Multi-Die Designs
To realize best system performance for the target workloads, designers must efficiently explore the appropriate partitions and system-level interconnect fabric. Reusing IP effectively to meet time-to-market and ensuring testability are among some of the challenges that require fast and early analysis-driven exploration. With early architecture exploration and analysis, system designers can optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.
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Featured Resources
- Synopsys and Altera, an Intel Company, Present: A Data Driven Approach to Multi-Die Design Architecture
- Early Architecture Performance and Power Analysis of Multi-Die Design
- Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology
- The A-Z of Multi-Die Design
- Executive Brief: Reach New Levels of Performance with Optimized System Power
Software Development for Multi-Die Designs
Software teams can quickly develop, integrate, and test the software by having access to proven virtual die models. Assembling virtual models in a multi-die prototype allows for efficient software bring-up, debug, and analysis. Software teams can run large amounts of software in lockstep with the hardware using a unified, hybrid emulation and prototype environment.
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Design Implementation for Multi-Die Designs
For seamless migration from 2D to 3D heterogeneous integration, designers require a highly integrated die/package co-design and optimization platform. Such platform can help designers with feasibility exploration, partitioning, and foundry technology selection for prototyping and floorplanning. This enables analysis-driven design implementation, including advanced packaging and die-to-die routing, with signoff verification. With a unified exploration-to-signoff platform, designers can achieve high quality of returns and accelerate time to market.
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Silicon IP for Multi-Die Designs
The core component of any chip is the IP, which represents a distinct while vital function within the chip and system. Die-to-die connectivity IP, allows high-bandwidth, low power, and robust links between heterogeneous and homogeneous dies in a single 2.5D or 3D multi-die package. 3D-enabled interface IP can help minimize the complexity of chip-to-chip connectivity supporting various die topologies in a 3D stacked design. High-quality, complete controller, PHY, and verification IP solutions that are silicon proven, have achieved interoperability with ecosystem products, and are compliant with the most widely used standards can minimize integration risk and accelerate time to market.
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Featured Resources
- Pre-Silicon Verification of Die-to-Die IP with Novel ESD Protection
- Enabling Efficient Multi-Die Design Implementation and IP Integration
- UCIe Standard vs. UCIe Advanced: What Designers Need to Know
- Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
- Synopsys 3DIO Solution for Multi-Die Integration (2.5D/3D)
Manufacturing & Health for Multi-Die Designs
Designers can help improve the long-term health and reliability by testing, diagnosing, repairing, calibrating, and improving operational metrics at every phase of the multi-die lifecycle. In addition, access to traceability and analytics across the dies for in-design, in-ramp, in-production and in-field optimization can help designers improve cost, quality, and reliability. Allow binning of high-quality and high-performing dies for consideration during package assembly.
Ecosystem Partners
Learn about our collaboration with our ecosystem partners in multi-die designs
Featured Resources
Looking for more resources to help with your multi-die designs? Explore our resources.
Resource Library
Explore videos, whitepapers, podcasts, and webinars to enhance your understanding and utilization of multi-die designs.
Explore Our Insights
Stay updated with Synopsys blogs featuring the newest trends and innovations in multi-die designs.
Frequently Asked Questions
Multi-die technology integrates multiple heterogeneous dies (or chiplets) into a single package. Each die typically performs a specific function, and they are interconnected via standards such as Universal Chiplet Interconnect Express (UCIe) to form a cohesive system. Multi-die technology offers flexibility, scalability, and cost-effectiveness compared to traditional monolithic chip designs.
In traditional monolithic chip design, all components are fabricated on a single piece of semiconductor material. In contrast, multi-die technology assembles multiple heterogeneous dies, fabricated on different foundry processes, into a single package. This allows for greater customization, mix-and-match of technologies, and improved yield management.
Multi-die technology accelerates scaling of system functionality, reduces risk and time-to-market by re-using proven dies, lowers system power while increasing throughput, and offers new product variants for flexible portfolio management.
Synopsys offers a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.
Synopsys offers a range of products within its multi-die solution. These products help SoC and system architects and designers overcome challenges of multi-die design in the areas of architecture exploration, die/package co-design, multi-physics analysis, software development and validation, verification, die-to-die IP, test and repair, system signoff, and silicon lifecycle management.
Yes, Synopsys multi-die solution supports interoperability with common design formats, interfaces, and standards, some of which include 3Dblox and UCIe.
Synopsys offers comprehensive technical support, training programs, documentation, and community forums to assist users in adopting and mastering multi-die design methodologies using its solution. This includes access to expert application engineers, online resources, and user forums for sharing best practices and troubleshooting common issues.