AI Chip Development Solutions

The software portion of AI chip development highlights the importance of early software development and system verification to keep pace with hardware advancements. By using a Shift-Left approach, teams can code and test software alongside hardware design, allowing for early issue identification and resolution. This proactive strategy accelerates time-to-market and improves the quality and reliability of the final product by ensuring seamless integration of software and hardware.​

Traditional simulation-based verification methods require augmentation with hardware-assisted verification (HAV) to keep up with the sheer scale, interconnect density, and software load these systems demand. By accelerating the execution of RTL and enabling real-time interface and software validation, HAV platforms provide the throughput and insight needed to validate designs comprising billions of gates and quadrillions of verification cycles. 

• Virtualizer
• ZeBu
• ZeBu Cloud
• HAPS

• Whitepaper: Virtualizer Native Execution Accelerates Software Defined Product Development for Arm Solutions
• Whitepaper: Benchmark Before You Build
• Datasheet: HAPS-200
• Datasheet: ZeBu-200
• Webinar: Verifying AI Designs - Solving the Challenge of Quadrillions of Verification Cycles
• Blog: Synopsys HAPS-200 and ZeBu-200 Expand the Industry’s Highest Performance Hardware-Assisted Verification Portfolio
• Presentation: Pioneering Innovation - The Future of Semiconductor Collaboration in the Age of AI

The silicon front-end phase involves the initial stages of chip design, focusing on RTL design and verification to ensure the architecture is correctlyimplemented and optimized for performance and power efficiency. This phase is crucial for minimizing logic and functional flaws to avoid costly respins. In contrast, the silicon back-end phase finalizes the layout and conducts rigorous verification to ensure manufacturability and reliability,addressing challenges like power integrity and timing closure before production.​

Synopsys Cloud enables delivery of Synopsys EDA tools, IP and infrastructure for end-to-end chip design through a browser leveraging infrastructure available from Microsoft Azure, AWS, or Google Cloud. With its unique FlexEDA business model, and patented license management and metering service, designers can scale EDA workloads with extreme flexibility.

• Silicon Front-End : Synopsys.ai, VCS, Verdi, VC SpyGlass, VC Formal, ZeBu, HAPS, HBM IP, DDR/LPDDR, PCIe, Ultra Ethernet​ IP
• Silicon Back-End: RTL Architect, Design Compiler, Fusion Compiler, IC Compiler II, DSO.ai, PrimeTime, PrimeShield, PrimeClosure, StarRC, IC Validator, NanoTime, ESP
• Synopsys Cloud​​

• Brochure: Synopsys.ai – Full Stack, AI-Driven EDA Suite
• Whitepaper: Accelerating Coverage Closure with AI-Based Verification Space Optimization
• Datasheet: VC Formal
• Webinar: Accelerating AI-driven Debug and Verification Management with Next-Gen Verdi Platform
• Webinar: Accelerate Coverage Closure Using AI/ML-based VCS ICO Technology
• White Paper: Ensure Zero Functional CDC Signoff Defects with VC SpyGlass Integrated Solution
• Datasheet: Fusion Compiler
• White Paper: Faster and Better Floorplanning with ML-Based Macro Placement
• White Paper: Lower Process Nodes Drive Timing Signoff Software Evolution
• Demo Video: Deep Dive into Synopsys DSO.ai
• Datasheet: Ultra Ethernet IP
• Success Story: Applied Brain Research Tapes Out sub-50mW Processor for Edge Device AI on Synopsys Cloud
• Success Story: DreamBig Semiconductor Boosts Engineering Productivity by 20% to Tapeout AI Accelerator and Network Chiplets with Synopsys 3DIC Compiler on Synopsys Cloud

The packaging phase in chip development integrates the silicon die with a package substrate, ensuring proper electrical connections and thermal management. Advanced techniques like 2.5D and 3D integration enhance performance by reducing signal latency and improving power distribution.Effective packaging is crucial for the chip's overall functionality, reliability, and manufacturability.​

• Multi-Die
• 3DIC Compiler

• Start Guide: Multi-Die
• eBook: Innovate Faster with Synopsys Multi-Die Solution
• Executive Brief: Reach New Levels of Performance with Optimized System Power

Security IP is crucial in chip design, offering hardware solutions to protect against data breaches and unauthorized access. Components likecryptographic cores and secure boot mechanisms ensure the integrity and confidentiality of sensitive information. Integrating robust Security IP solutions enhances the resilience of products against evolving cyber threats.​

• Security IP

• Brochure: Security IP
• White Paper: Secure Interfaces for Critical Semiconductor Applications
• Webinar: How to Approach Security for Multi-Die Designs
• White Paper: SRAM PUF - The Secure Silicon Fingerprint

Silicon Lifecycle Management (SLM) optimizes chip performance and reliability throughout its entire lifecycle, from design to in-field monitoring.By utilizing embedded sensors and real-time analytics, SLM enables proactive management of power, performance, and potential failures. Thisapproach not only enhances the longevity of the chip but also informs future design improvements based on real-world data.​

• Silicon Lifecycle Management

• Brochure: Silicon Lifecycle Management Family
• Webinar: In-Field RAS Challenges with Chiplets and AI-based Systems
• Whitepaper: Actionable Silicon Insights Through Intelligent Measurement and Analysis