Mastering AI Chip Complexity
Explore challenges and solutions in AI chip development
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Synopsys 3DIC Compiler, built on the industry’s leading digital implementation platform and using a common fusion data model, enables seamless migration to 2.5D and 3D heterogeneous integration. In a single environment, the platform allows analysis-driven feasibility exploration, multi-die partitioning, and foundry technology selection for prototyping and floorplanning. This enables analysis-driven design implementation, including advanced packaging and die-to-die routing, with golden signoff verification. 3DIC Compiler integrates with Synopsys 3DSO.ai, the industry’s first autonomous AI optimization solution for multi-die designs, to maximize system performance and quality of results for thermal integrity, signal integrity, and power network design. The 3DIC Compiler platform, successfully adopted by customers, is certified by leading foundries for advanced process and packaging technologies.
Differentiated Features
- Offers advanced system analysis and optimization capabilities for thermal analysis, signal integrity analysis, and power delivery network (PDN).
- Supports a wide range of advanced packaging technologies, including 2.5D/3D packaging, interposer-based designs, through-silicon via (TSV), and hybrid bonding.
- Supports a wide range of foundry technology for multi-die design, including TSMC, Samsung, Intel, GlobalFoundries, Rapidus, UMC, and SMIC.
- Integrates with silicon-proven Synopsys IP solutions for fast and reliable die-to-die and chip-to-chip connectivity to streamline implementation and IP integration.
- Delivers capabilities for early physical-aware functional architecture exploration and optimization using Platform Architect for Multi-Die.
- Integrates with Synopsys manufacturing and reliability IP solutions for silicon lifecycle management and in-production / in-field monitor, test, and repair.
What's New
Webinar
May 21, 2025
AMD Presents: 3D Odyssey - Navigating the Depths of 3DIC Feasibility Analysis
White Paper
Achieving Successful Timing, Power, and Physical Signoff for Multi-Die Designs
