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3DIC Compiler

The Industry’s Only Unified, 2.5D and 3D Multi-die Package Co-design and Analysis Platform

The Synopsys 3DIC Compiler platform is a complete, end-to-end solution for efficient, 2.5D, and 3D multi-die system integration. Built on the common, single-data-model infrastructure of the Synopsys Fusion Design Platform™, 3DIC Compiler coalesces numerous transformative, multi-die design capabilities to offer a complete architecture-to-signoff platform – all in a unique, consolidated user environment. This hyper-converged solution comprises immersive 2D and 3D visualization, cross-hierarchy exploration and planning, design and implementation, DFx, and system-level validation and signoff analysis. Take advantage of the highest levels of design efficiency with the ability to scale in capacity and performance to seamlessly support dozens of stacked, heterogeneous-process dies, comprising billions of inter-die connections.

Key Benefits

Unmatched Scalability

System-of-chips integration over hundreds of billions of transistors

High Productivity

Fast exploration and design using world-class implementation and analysis engines

Golden Signoff

Full spectrum design closure and convergence to optimal PPA/mm³

What's New

Explore our library of news, blogs, webinars and other helpful resources.

Samsung Electronics

Together, Synopsys and Samsung Foundry are easing the way to optimized multi-die designs through early to full system implementation and signoff analysis. Co-design and co-analysis of silicon and advanced packages with Synopsys' 3DIC Compiler platform is another example of how our close collaboration results in advanced productivity solutions that reduce turnaround time and costs for our mutual customers."

Sangyun Kim
VP of Foundry Design Technology Team, Samsung Electronics

TSMC

We're pleased to congratulate Synopsys as the winner of multiple 2021 TSMC OIP Partner of the Year awards for IP and EDA solutions in recognition of its efforts to enable semiconductor innovation. TSMC looks forward to our continued partnership with Synopsys to address our customers' needs with certified design solutions and IP using TSMC's latest technologies, continuing to push the boundaries of silicon success."

Suk Lee
VP of the Design Infrastructure Management Division, TSMC

TSMC

TSMC works closely with our Open Innovation Platform® (OIP) ecosystem partners to enable the next wave of innovation in the HPC space. This joint effort combining Synopsys' 3DIC Compiler platform and TSMC's chip stacking and advanced packaging technologies will help our customers meet design requirements on power and performance and achieve success in leading-edge SoC designs for HPC applications."

Suk Lee
VP of the Design Infrastructure Management Division, TSMC

Samsung Electronics

Our collaboration with Synopsys provides customers with a comprehensive co-design and co-analysis solution for designing with Samsung's MDI technologies ensuring high productivity and faster time to production.“

Sangyun Kim
VP of Foundry Design Technology Team, Samsung Electronics

TSMC

TSMC's Innovative 3DIC technologies such as CoWoS® and InFO enable customer innovation with greater functionality and enhanced system performance at increasingly competitive costs. Our collaboration with Synopsys provides customers with a certified solution for designing with TSMC's CoWoS® and InFO packaging technologies to enable high productivity and faster time to functional silicon."

Suk Lee
VP of the Design Infrastructure Management Division, TSMC

3DIC Design Panel
Crossing Over from Buzz to Adoption

In this session, industry luminaries from AMD, Intel, Qualcomm, Stanford University discuss emerging usage of 3DIC across multiple verticals, including HPC, datacenter and mobile. Hear insights on its abundant promise, challenges, and how to move this exciting technology faster and further into the design ecosystem and normalize it as a go-to methodology.

Latest Videos

Chairman and co-CEO Aart de Geus highlights the scalability, optimality, and verifiability of Synopsys’ 3DIC Solution in this excerpt from the ISSCC keynote "Catalysts of the Impossible: Silicon, Software, and Smarts for the Era of SysMoore”.

Shankar Krishnamoorthy, GM, Silicon Realization Group, discusses how multi-die design is now being used in various market segments to overcome system challenges.

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3DIC Compiler