The Synopsys 3DIC Compiler platform is a complete, end-to-end solution for efficient, 2.5D, and 3D multi-die system integration. Built on the common, single-data-model infrastructure of the Synopsys Fusion Design Platform™, 3DIC Compiler coalesces numerous transformative, multi-die design capabilities to offer a complete architecture-to-signoff platform – all in a unique, consolidated user environment. This hyper-converged solution comprises immersive 2D and 3D visualization, cross-hierarchy exploration and planning, design and implementation, DFx, and system-level validation and signoff analysis. Take advantage of the highest levels of design efficiency with the ability to scale in capacity and performance to seamlessly support dozens of stacked, heterogeneous-process dies, comprising billions of inter-die connections.
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3DIC Compiler
The Industry’s Only Unified, 2.5D and 3D Multi-die Package Co-design and Analysis Platform
Key Benefits
Unmatched Scalability
System-of-chips integration over hundreds of billions of transistors
High Productivity
Fast exploration and design using world-class implementation and analysis engines
Golden Signoff
Full spectrum design closure and convergence to optimal PPA/mm3What's New
Explore our library of news, blogs, webinars and other helpful resources.
Digital Design Technology Symposium
A Virtual Experience #DDTS2021
Additional Resources
SNUG Presentation
Successful 2.5D and 3D Multi-die Silicon System Design using Synopsys' 3DIC Compiler and Ansys' Multiphysics Analysis
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