IC design data model, enabling scalability in capacity and performance while supporting hundreds of thousands of inter-die interconnects which traditional IC packaging tools fail to deliver. It provides a full set of automated features along with power integrity, thermal, and noise-aware optimization that reduces the number of iterations.
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3DIC Compiler
Unified platform for End-to-End Multi-die Integration in a Package
3DIC Compiler is industry’s first unified platform for advanced multi-die system design and integration, with a single graphics user environment and 3D visualization, for exploration, design, implementation, validation, and signoff. It is built on the Synopsys Fusion Design Platform SoC-scale
Benefits
- Holistic approach to multi-die integration, for an optimal system in a package solution
- Powerful 3D viewing of the unified platform provides an intuitive environment and reduces overall integration time
- Seamless integration of Ansys’ silicon-package-PCB technology for system level signal and power integrity, and thermal analysis, enables faster convergence and reduces the need for iterations
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