Cloud native EDA tools & pre-optimized hardware platforms
Synopsys 3DIC Compiler, built on the industry’s leading digital implementation platform and using a common fusion data model, enables seamless migration to 2.5/3D heterogeneous integration. In a single environment, the platform allows analysis-driven feasibility exploration, multi-die partitioning, and foundry technology selection for prototyping and floorplanning. This enables analysis-driven design implementation, including advanced packaging and die-to-die routing, with golden signoff verification. 3DIC Compiler integrates with Synopsys 3DSO.ai, the industry’s first autonomous AI optimization solution for multi-die designs, to maximize system performance and quality of results for thermal integrity, signal integrity, and power network design. The 3DIC Compiler platform, successfully adopted by customers, is certified by leading foundries for advanced process and packaging technologies.
In his Chiplet Summit keynote, Abhijeet Chakraborty, VP of Engineering at Synopsys, talks about how multi-die designs are now the mainstream and open up innovation in a wide range of applications.
Shankar Krishnamoorthy, GM, Silicon Realization Group, discusses how multi-die design is now being used in various market segments to overcome system challenges.
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