3DIC Compiler Platform

Synopsys 3DIC Compiler, a unified exploration-to-signoff platform, enables seamless migration to 2.5D and 3D heterogeneous integration. The 3DIC Compiler platform, successfully adopted by customers, is certified by leading foundries for advanced process and packaging technologies.

In a single environment, the platform:

• Enables analysis-driven feasibility exploration, partitioning, prototyping, and floorplanning for comprehensive full-stack designs
• Accelerates advanced packaging design with automated high-speed die-to-die routing, multiphysics analysis, and signoff verification

Download the brochure to find out how to make your die/package co-design more seamless.