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Comprehensive Voltage Drop and Electromigration Signoff Solution for Digital Semiconductors
Synopsys RedHawk-SC is the proven industry leader for digital power integrity signoff, delivering comprehensive EM/IR analysis and dynamic voltage drop (DVD) coverage for digital IP and SoCs down to 1.6nm. Built on cloud-optimized elastic compute infrastructure, RedHawk-SC enables fast, scalable, and silicon-correlated signoff with certified accuracy across all major foundries.
Key Benefits
Features
Voltage Drop Signoff with SigmaDVD™ Technology
RedHawk-SC’s breakthrough SigmaDVD technology provides full coverage of dynamic voltage drop with root-cause identification of top victims and aggressors. SigmaDVD achieves the same accuracy as transient simulation techniques in a fraction of the run time, ensuring reliable power distribution across all activity scenarios.
Integrated With Synopsys Fusion Compiler and IC Compiler II for In-Design Power Integrity Optimization
RedHawk-SC is embedded within Synopsys physical implementation to ensure early IR-drop avoidance and in-design optimization of power network reliability and efficiency.
Thermal-Aware Electromigration Analysis
Comprehensive electromigration (EM) analysis evaluates current density reliability across power and signal interconnects with statistical EM budgeting. The EM analysis includes thermal effects due to self-heating of transistors and interconnect (Joule heating), which avoids reliability risks and ensure long-term device performance.
Timing Impact of IR-Drop
RedHawk-SC works with Synopsys PrimeTime to calculate the timing impact of per-instance voltage variation based on full-coverage SigmaDVD analysis.
Incremental IR-ECO Fixing
Integration with Synopsys PrimeClosure empowers engineers to accelerate incremental ECO fixing and design closure. Switching aggressors are identified, enabling targeted and efficient IR drop optimization without compromising circuit timing.
Hierarchical Reduced-Order Models
Chip Power Models (CPMs), Chip Thermal Models (CTMs), and other reduced-order models (ROMs) enable efficient hierarchical analysis of single chips and full-system multi-die 2.5D/3D-IC assemblies.
Vectored and Vectorless Activity Coverage
Supports multi-scenario activity patterns, including customer-generated and automatic (vectorless) inputs, to capture dynamic power supply noise caused by specified activity patterns.
Multi-die Electrothermal Co-simulation
RedHawk-SC works with RedHawk-SC Electrothermal to enable power and thermal integrity co-simulation for chips and 2.5D/3D IC packages.
Cloud-Optimized Elastic Compute Architecture
Built on the SeaScape™ platform, RedHawk-SC supports near-linear scalability across thousands of CPU cores, enabling ultra-large, full-chip analysis with low memory requirements for all cores and seamless integration into cloud environments.
Technical Capabilities
Synopsys RedHawk-SC is the industry’s trusted gold standard for voltage drop and electromigration signoff solutions for digital SoCs and multi-die assemblies. Its breakthrough SigmaDVD™ technology provides complete coverage for dynamic voltage drop analysis while reduced-order models enable efficient hierarchical analysis.
Its powerful analytics are available in Fusion Compiler/IC Compiler II to identify weaknesses and allow what-if explorations that help optimize power and performance. Signoff integration with Synopsys PrimeTime (IR-STA) and Synopsys PrimeClosure (IR-ECO) accelerate design closure with accurate optimization feedback. Redhawk-SC’s cloud-based architecture gives it the speed and capacity to handle full-chip analysis. Signoff accuracy is certified by all major foundries for all finFET nodes down to 1.6 nm.
FAQ
RedHawk-SC’s multiphysics algorithms are certified by all major foundries for finFET processes down to 1.6nm, proven in thousands of tapeouts.
Yes, its cloud-native elastic compute architecture enables rapid, scalable analysis of ultra-large designs with modest memory requirements.
RedHawk-SC supports both vector and vectorless activity to complement the much more complete dynamic voltage drop coverage provided by the integrated SigmaDVD technology.
RedHawk-SC provides scalable multi-die power integrity analysis. In addition, RedHawk-SC works with RedHawk-SC Electrothermal to enable thermal and power integrity co-simulation for chips and multi-die systems.
Features include advanced build-quality metrics for the power network, what-if scenario exploration, early voltage drop avoidance at the placement stage, voltage-aware timing with Synopsys PrimeTime, and incremental IR drop ECO fixing with Synopsys PrimeClosure.