It delivers HSPICE® accurate signoff analysis that helps pinpoint problems prior to chip tapeout thereby reducing risk, ensuring design integrity, and lowering the cost of design. This industry gold-standard improves your team’s productivity by delivering fast turnaround to shave precious time from development schedules for large and small designs while ensuring first-pass silicon success through greater predictability and the highest accuracy. The solution is scalable to handle the largest chips imaginable with distributed analysis, scalable architecture and hierarchical methodology.