DesignWare Technical Bulletin
In-depth technical articles, white papers, videos, webinars, product announcements and more
Learn how meeting die-to-die implementation requirements in a multi-die SoC can improve modularity and yield.
Learn about new automotive standards-compliant hardware secure module IP for safe and secure SoCs.
Learn how the shift from traditional storage and processing solutions can boost performance and reduce the amount of data transferred.
Learn how integrating the Ethernet MAC & PHY IP accelerates the path to design closure.
Learn how scalable, reliable OTP NVM IP for CMOS image sensors offers high security and reliability in a small footprint.
In this Q&A with Jumana Muwafi, Sr. VP of Engineering at Synopsys, hear her vision about the future of IP in electronic design.
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