3DIC Compiler: Platform for Multi-Die Designs
PrimeSim: Circuit Simulation Solution
TestMAX: Advanced Test Automation Solutions
RTL Design & Synthesis Solutions for Advanced Nodes
Physical Implementation Solutions for Optimal PPA
Physical Verification: IC Validator
Design Signoff: Trusted Golden Solution for Chip Designs
LynxNXT Automation System: Design Automation
Platform Architect: SoC Architecture Analysis & Optimization
Platform Architect for Multi-Die
Virtualizer: VDK Creation & Deployment Tools
Virtualizer Models: Transaction-Level Models
Silver: Software-in-the-Loop Solution for Virtual ECUs
Automotive Ecosystem Collaboration
TestWeaver: Virtual Testing Solution
SaberES Designer: Vehicle Electrical System Design
What is ADAS (Advanced Driver Assistance Systems)?
What is an Autonomous Car? – How Self-Driving Cars Work
What is a Battery Management System (BMS)? – How it Works
What is Electronic Design Automation (EDA)? – How it Works
What is a Physical Unclonable Function (PUF)? – How it Works
What is RISC-V? – How Does it Work?
The 6 Levels of Vehicle Autonomy Explained
Unified Power Format Expands Low-Power IC Design
Multi-Chip Module Packaging Types | Multi-Die Chip Design
RRAM & MRAM: Non-Volatile Memory Explained
What is Mobile Industry Processor Interface (MIPI) Protocol?
Power Semiconductor Devices Explained
What is Software-in-the-Loop (SiL) Testing?
Mastering DDR-PHY Interoperability via DFI
Understanding System-on-Chip (SoC): Components, Construction, & Capabilities