Go Back
By Industry
By Technology
Synopsys Cloud
Synopsys Cloud

Cloud native EDA tools & pre-optimized hardware platforms

Request a Free Trial →
Multi-Die Innovate Faster eBook
Innovate Faster with Synopsys Multi-Die Solution

Accelerating success from early architecture to manufacturing.

Download eBook →
View All Solutions →
Explore Silicon Design, Verification & Manufacturing

Synopsys is a leading provider of electronic design automation solutions and services.

Families
Optical Design
Photonic Design
Design
3D Image Processing
Verification
Modeling & Simulation
Manufacturing
Try Synopsys Cloud
Synopsys Cloud

Unlimited access to EDA software licenses on-demand

Request a Free Trial →
Explore Silicon IP

Synopsys is a leading provider of high-quality, silicon-proven semiconductor IP solutions for SoC designs.

Interface IP
Processor IP
Memories & Libraries
SoC Architecture
Security IP
SoC Infrastructure IP
IP Accelerated
IP Markets
Synopsys IP Portfolio Cover
Synopsys IP Portfolio
Download Brochure →
Synopsys IP Technical Bulletin
Read Latest Issue →
Explore Systems Verification and Validation

Synopsys is a leading provider of hardware-assisted verification and virtualization solutions.

Emulation
System Test Generation
Verification IP
FPGA Development
Prototyping
Virtual Prototyping
View All Products →
Company Overview
Resources
Success Stories | Synopsys
Success Stories

Explore our success stories.

Learn More →
Synopsys Job Search Thumbnail
Pursue Your Passion

Start Your Job Search

Apply Now →

Popular Searches: Synopsys.ai Synopsys Cloud Multi-Die Silicon IP

Spotlight

2 min read / Dec 11, 2024

Enabling Massive AI Clusters with the Industry’s First Ultra Ethernet and UALink IP Solutions
Jon Ames
Ron Lowman
By Jon Ames, Ron Lowman
Tags:

Enabling Massive AI Clusters with the Industry’s First Ultra Ethernet and UALink IP Solutions

By Ron Lowman , Jon Ames

2 min read / Dec 11, 2024

Tags: Chip Design Insights , Interface IP , HPC, Data Center , Silicon IP

Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

By Sween Kang

2 min read / Dec 05, 2024

Tags: Multi-Die System , Chip Design Insights , Design , Manufacturing , Foundation IP , HPC, Data Center , Silicon IP , 3DIC Compiler

Advancing Software-Defined, Silicon-Optimized Data Centers

By Synopsys Editorial Staff

3 min read / Nov 21, 2024

Tags: Chip Design Insights , Interface IP , HPC, Data Center , Silicon IP

World's First CXL 3.1 Multi-Vendor Interoperability Demo Showcases New Memory Possibilities for Hyperscale Data Centers

By Gary Ruggles , Gordon Getty

2 min read / Nov 20, 2024

Tags: Synopsys IP Technical Bulletin , Chip Design Insights , Interface IP , HPC, Data Center , Silicon IP

Trending Topics

AI Chip Design
Explore More
EDA in the Cloud
Explore More
Multi-Die Systems
Explore More

Trending Voices

Marc Serughetti

Vice President, Product Line Management, Product Management Group

Explore Articles

Vikram Bhatia

Head of Cloud Product Management & GTM Strategy

Explore Articles

Stelios Diamantidis

Distinguished Architect, Executive Director, Center for Generative AI

Explore Articles

Shekhar Kapoor

Executive Director, Product Management, Semiconductor IC & System Design

Explore Articles

Explore Topics

Products
Industries
Technologies
Blog Series