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Popular Searches: Synopsys.ai Synopsys Cloud Multi-Die Silicon IP

Spotlight

Synopsys and Ansys Are Now United: Together, We Will Ignite Innovation from Silicon to Systems

By Sassine Ghazi

4 min read / Jul 17, 2025

Tags: Chip Design Insights , Inside Synopsys

Automotive Reckoning: Industry Leaders Discuss the Race to Redefine Car Development

By Synopsys Editorial Staff

3 min read / Jul 15, 2025

Tags: Chip Design Insights , Simulation , Design , Automotive , Verification , Virtual Prototyping

Driving the Future of Automotive: How Synopsys and Tata Elxsi Are Powering Electronics Digital Twin (eDT) Adoption

By Marc Serughetti

2 min read / Jul 11, 2025

Tags: Test , Chip Design Insights , Simulation , Design , Automotive , Verification , Virtual Prototyping

Solving Analog Design Challenges to Power Our Digital World

By Sumit Vishwakarma

4 min read / Jul 08, 2025

Tags: AI & Machine Learning , Memory , RF Design , Insights , Energy-Efficient SoCs , Cloud , AMS Verification , Signal & Power Integrity , Chip Design Insights , Design , AMS Simulation , Cloud Insights , Verification , Analog Design

RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

Tags: Verification Central, Multi-Die System, RTL Synthesis, Static & Formal Verification, AI & Machine Learning, Debug, Physical Verification, Test, Simulation, Energy-Efficient SoCs, Signoff, Chip Design Insights, Design, Verification, Formal Verification

6 min read/ Jun 25, 2025

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

By Synopsys Editorial Staff

Tags: AI & Machine Learning, Chip Design Insights, Design, Design Technology Co-Optimization, Silicon IP

3 min read/ May 28, 2025

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Synopsys Editorial Staff

Tags: Verification Central, Multi-Die System, AI & Machine Learning, Memory, Chip Design Insights, Design, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

EDA in the Cloud

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4 min read/Jul 08, 2025

Solving Analog Design Challenges to Power Our Digital World

By Sumit Vishwakarma

4 min read/Jul 08, 2025

Tags: AI & Machine Learning, Memory, RF Design, Insights, Energy-Efficient SoCs, Cloud, AMS Verification, Signal & Power Integrity, Chip Design Insights, Design, AMS Simulation, Cloud Insights, Verification, Analog Design

5 min read/ Jun 10, 2025

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

By Gunnar Braun, Stewart Williams

Tags: Cloud, Insights, Chip Design Insights, Automotive, Cloud Insights, Verification, Virtual Prototyping

5 min read/ Jun 04, 2025

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

By Tom De Schutter

Tags: Cloud, Chip Design Insights, Design, Verification IP, Automotive, Verification, Virtual Prototyping

3 min read/ May 22, 2025

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Verification Central, Cloud, Multi-Die System, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

Multi-Die Systems

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5 min read/Jul 01, 2025

RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

5 min read/Jul 01, 2025

3 min read/ May 28, 2025

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Synopsys Editorial Staff

Tags: Verification Central, Multi-Die System, AI & Machine Learning, Memory, Chip Design Insights, Design, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

3 min read/ May 22, 2025

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Verification Central, Cloud, Multi-Die System, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

4 min read/ May 15, 2025

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

By Frank Malloy

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Design

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Marc Serughetti

Vice President, Product Line Management, Product Management Group

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Vikram Bhatia

Head of Cloud Product Management & GTM Strategy

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Magaly Sandoval-Pichardo

Program Manager, HPC and Interface IP Solutions

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Shekhar Kapoor

Executive Director, Product Management, Semiconductor IC & System Design

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Spotlight

Synopsys and Ansys Are Now United: Together, We Will Ignite Innovation from Silicon to Systems

Automotive Reckoning: Industry Leaders Discuss the Race to Redefine Car Development

Driving the Future of Automotive: How Synopsys and Tata Elxsi Are Powering Electronics Digital Twin (eDT) Adoption

Solving Analog Design Challenges to Power Our Digital World

Trending Topics

Solving Analog Design Challenges to Power Our Digital World

RTL Signoff vs. Functional Signoff: What’s the Difference?

RTL Signoff vs. Functional Signoff: What’s the Difference?

The Integrated Design Challenge: Developing Chip, Software, and System in Unison

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

Solving Analog Design Challenges to Power Our Digital World

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

Software-Defined Vehicles: Agile Development with Cloud-Based Virtual Prototypes

Synopsys Expands Collaboration with Arm to Accelerate the Automotive Industry’s Transformation to Software-Defined Vehicles

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

RTL Signoff vs. Functional Signoff: What’s the Difference?

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

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