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Stop Treating Fanout RDL Like Substrate Routing

By Soheil Modirzadeh

Tags: Multi-Die, Engineering Central, Design, 3DIC Design

World’s First 3D PCIe 6.0 PHY 8-Lane Test Chip Validates High-Speed Connectivity for Multi-Die Designs

BLOG Aug 19, 2026/2 min read

BLOG

World’s First 3D PCIe 6.0 PHY 8-Lane Test Chip Validates High-Speed Connectivity for Multi-Die Designs

By Madhumita Sanyal, Manmeet Walia

Tags: Multi-Die, Engineering Central, Interface IP, Silicon IP

Stop Finding HBM Signal Integrity Problems After Routing

BLOG Aug 18, 2026/2 min read

BLOG

Stop Finding HBM Signal Integrity Problems After Routing

By Soheil Modirzadeh

Tags: Multi-Die, Engineering Central, Design, 3DIC Design

Stop Guessing on Multi-Die PG Planning: Let AI Find the IR-Drop Sweet Spot

BLOG Aug 14, 2026/1 min read

BLOG

Stop Guessing on Multi-Die PG Planning: Let AI Find the IR-Drop Sweet Spot

By Soheil Modirzadeh

Tags: Multi-Die, Engineering Central, Design, 3DIC Design

Multi-Die, Multiphysics, and the New Rules of Chip Design

BLOG Jul 29, 2026/4 min read

BLOG

Multi-Die, Multiphysics, and the New Rules of Chip Design

By Greg Sorber

Tags: Executive Voices, Multi-Die, AI & Machine Learning, Design, About Synopsys, Verification

Why Co-Packaged Optics Is Becoming Essential for AI and HPC Multi-Die Designs

BLOG Jul 28, 2026/5 min read

BLOG

Why Co-Packaged Optics Is Becoming Essential for AI and HPC Multi-Die Designs

By Synopsys Editorial Staff

Tags: Multi-Die, Engineering Central

Silicon Meets Reality: Why Physics Is Now a First-Order Design Constraint for Chips

BLOG Jul 22, 2026/4 min read

BLOG

Silicon Meets Reality: Why Physics Is Now a First-Order Design Constraint for Chips

By Larry Williams

Tags: Multi-Die, Engineering Central, Design, About Synopsys, Multiphysics Fusion, Verification

Advancing UCIe Performance: Enabling 40G for Next-Generation Multi-Die Designs

BLOG Jun 30, 2026/2 min read

BLOG

Advancing UCIe Performance: Enabling 40G for Next-Generation Multi-Die Designs

By Manuel Mota

Tags: Multi-Die, Engineering Central, Interface IP, Silicon IP

From Overdesign to Co-Design: Confronting Multiphysics Challenges in Chips

BLOG Jun 17, 2026/4 min read

BLOG

From Overdesign to Co-Design: Confronting Multiphysics Challenges in Chips

By Sumit Vishwakarma

Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, Multiphysics Fusion, Verification

Designing the Future We Can Verify: A Vision for Multi-Die Design, STCO, and Trustworthy AI

BLOG May 27, 2026/4 min read

BLOG

Designing the Future We Can Verify: A Vision for Multi-Die Design, STCO, and Trustworthy AI

By Sutirtha Kabir

Tags: Executive Voices, Multi-Die, AI & Machine Learning, Design, About Synopsys, Design Technology Co-Optimization, Verification

Multi‑Die Design in Context: A Clear Comparison with Monolithic and PCB Designs

BLOG May 04, 2026/3 min read

BLOG

Multi‑Die Design in Context: A Clear Comparison with Monolithic and PCB Designs

By Amlendu Shekhar Choubey

Tags: Multi-Die, Engineering Central

Interface IP: The Keystone for 3D Multi-Die Designs

BLOG Apr 15, 2026/4 min read

BLOG

Interface IP: The Keystone for 3D Multi-Die Designs

By Madhumita Sanyal

Tags: Multi-Die, Engineering Central, Design, About Synopsys, Interface IP, Silicon IP

BLOG Apr 01, 2026/2 min read

BLOG

Synopsys Advances Die‑to‑Die Connectivity with 64G UCIe IP Tape‑Out

By Synopsys Editorial Staff

Tags: Multi-Die, Engineering Central, Interface IP, Silicon IP

Simulation Solutions for the Structural Integrity of Chip Packages

BLOG Mar 27, 2026/5 min read

BLOG

Simulation Solutions for the Structural Integrity of Chip Packages

By Marc Swinnen

Tags: Multi-Die, Design, Signoff

BLOG Mar 24, 2026/2 min read

BLOG

Safety-Aware Multi-Die ML Architectures for the AI-Defined Vehicle: Synopsys & SiMa.ai

By Synopsys Editorial Staff

Tags: Multi-Die, Engineering Central, Automotive

Accelerating Next-Generation EMIB-T Packaging: A Collaboration Between Synopsys and Intel Foundry

BLOG Mar 23, 2026/5 min read

BLOG

Accelerating Next-Generation EMIB-T Packaging: A Collaboration Between Synopsys and Intel Foundry

By Arun Bhattacharya

Tags: Multi-Die, Engineering Central, Design, 3DIC Design

New Synopsys Multiphysics Fusion™ Technology Set to Transform Chip and Product Engineering

BLOG Mar 11, 2026/4 min read

BLOG

New Synopsys Multiphysics Fusion™ Technology Set to Transform Chip and Product Engineering

By Marc Swinnen

Tags: Multi-Die, AI & Machine Learning, 3DIC Design, About Synopsys, Physical Implementation, Energy-Efficient SoCs, Signoff, Engineering Central, Signal & Power Integrity, Fusion Technology, Design, Fusion Design Platform, 5nm and Below, HPC, Data Center

Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design

BLOG Mar 03, 2026/4 min read

BLOG

Accelerating Multi-Die Innovation: How Synopsys and Samsung are Shaping Chip Design

By Amlendu Shekhar Choubey

Tags: Multi-Die, AI & Machine Learning, 3DIC Design, About Synopsys, Physical Implementation, Interface IP, Signoff, Engineering Central, Silicon Lifecycle Management, Signal & Power Integrity, Design, Manufacturing, Design Technology Co-Optimization, Silicon IP

World’s First HBM4 IP Test Chip: Early Silicon Validation for Next-Generation AI and HPC

BLOG Feb 27, 2026/3 min read

BLOG

World’s First HBM4 IP Test Chip: Early Silicon Validation for Next-Generation AI and HPC

By Brett Murdock

Tags: Multi-Die, Engineering Central, Interface IP, Silicon IP

Designing the Future: How 3DIC Compiler Is Powering Breakthroughs Across the MultiDie Design Landscape

BLOG Jan 30, 2026/4 min read

BLOG

Designing the Future: How 3DIC Compiler Is Powering Breakthroughs Across the MultiDie Design Landscape

By Shekhar Kapoor

Tags: Multi-Die, Engineering Central, Design, 3DIC Design

Register Now: Synopsys Converge 2026 Unites Silicon and Systems Communities to Re-Engineer the Future

BLOG Jan 20, 2026/4 min read

BLOG

Register Now: Synopsys Converge 2026 Unites Silicon and Systems Communities to Re-Engineer the Future

By Rob van Blommestein

Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, HPC, Data Center, Silicon IP, Verification

Visualizing Cross-Die Paths in Multi-Die Designs

BLOG Jan 13, 2026/3 min read

BLOG

Visualizing Cross-Die Paths in Multi-Die Designs

By Anshul Chawla

Tags: Multi-Die, Design, 3DIC Design

3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months

BLOG Dec 04, 2025/4 min read

BLOG

3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months

By Shekhar Kapoor

New Fujitsu Chip to Power Greener, Smarter Data Centers

BLOG Dec 02, 2025/4 min read

BLOG

New Fujitsu Chip to Power Greener, Smarter Data Centers

By Greg Sorber

Tags: Multi-Die, Debug, Simulation, 3DIC Design, Emulation, About Synopsys, Energy-Efficient SoCs, Customer Spotlight, Data Center, Design, 5nm and Below, HPC, Data Center, Verification

10 Tips for First-Pass Silicon Success in AI Chip Development

BLOG Nov 06, 2025/5 min read

BLOG

10 Tips for First-Pass Silicon Success in AI Chip Development

By Rita Horner, Todd Koelling, Frank Schirrmeister

Tags: Multi-Die, AI & Machine Learning, Test, Emulation, About Synopsys, Physical Implementation, Signoff, Virtual Prototyping, Engineering Central, Silicon Lifecycle Management, Design, HPC, Data Center, Silicon IP, Verification

How Multi-Die Designs Boost Automotive Chip Innovation

BLOG Nov 04, 2025/3 min read

BLOG

How Multi-Die Designs Boost Automotive Chip Innovation

By Sajani Patel, Hezi Saar

Tags: Multi-Die, Silicon Lifecycle Management, Design, 3DIC Design, About Synopsys, Physical Implementation, Automotive, Silicon IP, Verification, Virtual Prototyping

AI Chips: Why Pre-Silicon Planning Is Critical

BLOG Oct 14, 2025/3 min read

BLOG

AI Chips: Why Pre-Silicon Planning Is Critical

By Scott Knowlton, Kamal Desai, Sumit Vishwakarma

Tags: Multi-Die, AI & Machine Learning, Signal & Power Integrity, Simulation, Design, About Synopsys, Interface IP, Energy-Efficient SoCs, Foundation IP, Silicon IP, Verification, Virtual Prototyping

Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards

BLOG Oct 01, 2025/3 min read

BLOG

Shaping the Future of Semiconductor Design Through Collaboration: Synopsys Wins Multiple TSMC OIP Partner of the Year Awards

By Arun Bhattacharya

Tags: Multi-Die, AI & Machine Learning, RF Design, 3DIC Design, About Synopsys, Interface IP, Silicon Lifecycle Management, Signal & Power Integrity, Design, Design Technology Co-Optimization, Photonic, Silicon IP, Analog Design

A Beginner’s Guide to Chiplets: 8 Best Practices for Multi-Die Designs

BLOG Aug 26, 2025/4 min read

BLOG

A Beginner’s Guide to Chiplets: 8 Best Practices for Multi-Die Designs

By Rob Kruger

Tags: Multi-Die, AI & Machine Learning, Simulation, Design, About Synopsys, Interface IP, Foundation IP, Interface IP Subsystems, HPC, Data Center, Silicon IP, Verification

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

BLOG Aug 07, 2025/3 min read

BLOG

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

By Frank Malloy

Tags: Executive Voices, Multi-Die, AI & Machine Learning, Design, About Synopsys, Physical Implementation, Silicon IP, Verification, Virtual Prototyping

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

BLOG Aug 05, 2025/3 min read

BLOG

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

By Sajani Patel, Varun Agrawal, Manuel Mota

Tags: Multi-Die, Design, About Synopsys, Interface IP, Silicon IP

RTL Signoff vs. Functional Signoff: What’s the Difference?

BLOG Jul 01, 2025/5 min read

BLOG

RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

Tags: Multi-Die, RTL Synthesis, Static & Formal Verification, AI & Machine Learning, Debug, Physical Verification, Test, Simulation, About Synopsys, Energy-Efficient SoCs, Signoff, Design, Verification, Formal Verification

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

BLOG May 28, 2025/3 min read

BLOG

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Greg Sorber

Tags: Executive Voices, Multi-Die, AI & Machine Learning, Memory, Design, 3DIC Design, About Synopsys, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

BLOG May 22, 2025/3 min read

BLOG

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Cloud, Multi-Die, Prototyping, Design, About Synopsys, Verification, Virtual Prototyping

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

BLOG May 15, 2025/4 min read

BLOG

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

By Frank Malloy

Tags: Multi-Die, Design, 3DIC Design, About Synopsys

Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

BLOG Feb 06, 2025/2 min read

BLOG

Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

By Arun Bhattacharya

Tags: Multi-Die, Design, About Synopsys, Interface IP, Foundation IP, Silicon IP

Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

BLOG Jan 21, 2025/2 min read

BLOG

Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

By Shekhar Kapoor, Michael Posner

Tags: Multi-Die, Design, 3DIC Design, About Synopsys

Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances

BLOG Jan 09, 2025/5 min read

BLOG

Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances

By Faisal Goriawalla, Yervant Zorian

Tags: Multi-Die, Silicon Lifecycle Management, About Synopsys, Interface IP, Silicon IP

Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

BLOG Dec 05, 2024/2 min read

BLOG

Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

By Synopsys Editorial Staff

Tags: Multi-Die, Design, 3DIC Design, About Synopsys, Manufacturing, Foundation IP, HPC, Data Center, Silicon IP

Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs

BLOG Sep 09, 2024/4 min read

BLOG

Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs

By Manuel Mota

Tags: Multi-Die, About Synopsys, Interface IP, Silicon IP

UCIe 2.0 - Setting the Tone for Chiplet Interoperability

BLOG Aug 08, 2024/3 min read

BLOG

UCIe 2.0 - Setting the Tone for Chiplet Interoperability

By Prasad Subudhi K. S, Deepak Nagaria, Narasimha Babu G V L

Tags: Multi-Die, Engineering Central, Verification IP, Verification

Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

BLOG Jun 17, 2024/4 min read

BLOG

Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

By Manmeet Walia, Erez Shaizaf, Manuel Mota

Tags: Multi-Die, About Synopsys

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

BLOG Jun 12, 2024/5 min read

BLOG

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

By Synopsys Editorial Staff, WeiHsun Liao

Tags: Customer Spotlight, Multi-Die, Design, 3DIC Design, About Synopsys

Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

BLOG Apr 25, 2024/3 min read

BLOG

Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

By Michael Posner, Manuel Mota

Tags: Multi-Die, About Synopsys, Interface IP, Silicon IP

Faster, Higher Capacity Emulation and Prototyping for AI Workloads

BLOG Mar 20, 2024/4 min read

BLOG

Faster, Higher Capacity Emulation and Prototyping for AI Workloads

By Samskrut Konduru

Tags: Multi-Die, AI & Machine Learning, Prototyping, Emulation, About Synopsys, Verification

Industry Leaders Discuss “Overcoming the Challenges of Multi-die Systems Verification”

BLOG Mar 15, 2024/8 min read

BLOG

Industry Leaders Discuss “Overcoming the Challenges of Multi-die Systems Verification”

By Verification Expert

Tags: Multi-Die, Engineering Central, Verification

Industry's First Verification IP for Arm AMBA CHI-G

BLOG Mar 06, 2024/5 min read

BLOG

Industry's First Verification IP for Arm AMBA CHI-G

By Sudhanshu Rao

Tags: Multi-Die, Engineering Central, Verification IP, Verification

Synopsys AMBA CHI C2C System Verification Solutions

BLOG Feb 22, 2024/5 min read

BLOG

Synopsys AMBA CHI C2C System Verification Solutions

By Venkatesh Kudumula

Tags: Multi-Die, Engineering Central, Verification IP, Verification

Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology

BLOG Jan 23, 2024/4 min read

BLOG

Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology

By Kamal Desai

Tags: Multi-Die, Design, About Synopsys, Platform

Can 3DHI Meet the Demands of Aerospace and Government Applications?

BLOG Jan 22, 2024/5 min read

BLOG

Can 3DHI Meet the Demands of Aerospace and Government Applications?

By Kenneth Larsen, Ian Land, Rob Aitken

Tags: Multi-Die, Aerospace & Government, Design, About Synopsys

2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation

BLOG Dec 20, 2023/8 min read

BLOG

2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation

By Synopsys Editorial Staff

Tags: Cloud, Multi-Die, AI & Machine Learning, About Synopsys

Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip

BLOG Dec 14, 2023/4 min read

BLOG

Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip

By Manuel Mota

Tags: Multi-Die, About Synopsys, Interface IP, Silicon IP

What’s Next for Multi-Die Systems in 2024?

BLOG Dec 13, 2023/5 min read

BLOG

What’s Next for Multi-Die Systems in 2024?

By Shekhar Kapoor

Tags: Multi-Die, About Synopsys

How Photonics Can Light the Way for Higher Performing Multi-Die Systems

BLOG Nov 21, 2023/5 min read

BLOG

How Photonics Can Light the Way for Higher Performing Multi-Die Systems

By Kenneth Larsen, Twan Korthorst

Tags: Multi-Die, Design, About Synopsys, Photonic

Ensuring the Health and Reliability of Multi-Die Systems

BLOG Oct 11, 2023/7 min read

BLOG

Ensuring the Health and Reliability of Multi-Die Systems

By Randy Fish, Yervant Zorian, Manuel Mota, Guy Cortez

Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, HPC, Data Center

Industry Insights: How Collaboration Will Accelerate Adoption of Multi-Die Systems

BLOG Oct 04, 2023/6 min read

BLOG

Industry Insights: How Collaboration Will Accelerate Adoption of Multi-Die Systems

By Synopsys Editorial Staff

Tags: Multi-Die, About Synopsys

Samsung Foundry and Synopsys Accelerate Multi-Die System Design

BLOG Sep 21, 2023/4 min read

BLOG

Samsung Foundry and Synopsys Accelerate Multi-Die System Design

By Henry Sheng, Jennifer Pyon

Tags: Multi-Die, Design, About Synopsys

Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems

BLOG Sep 12, 2023/7 min read

BLOG

Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems

By Filip Thoen, Leonard Drucker, Vivek Prasad

Tags: Multi-Die, About Synopsys, Verification

Addressing Multi-Physics Effects for High-Performing Multi-Die Systems

BLOG Aug 22, 2023/4 min read

BLOG

Addressing Multi-Physics Effects for High-Performing Multi-Die Systems

By Shekhar Kapoor, Kenneth Larsen

Tags: Multi-Die, Design, About Synopsys

Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications

BLOG Aug 03, 2023/8 min read

BLOG

Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications

By Jigesh Patel, Kenneth Larsen, Ian Land

Tags: Multi-Die, Aerospace & Government, About Synopsys, Photonic

Key Considerations for Addressing Multi-Die System Verification Challenges

BLOG Aug 01, 2023/6 min read

BLOG

Key Considerations for Addressing Multi-Die System Verification Challenges

By Arturo Salz, Johannes Stahl

Tags: Multi-Die, About Synopsys, Verification

New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems

BLOG Jul 24, 2023/4 min read

BLOG

New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems

By Taruna Reddy

Tags: Multi-Die, About Synopsys, Verification

Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

BLOG Jun 28, 2023/7 min read

BLOG

Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

By Johannes Stahl, Tim Kogel

Tags: Multi-Die, About Synopsys, Blog, Verification, Virtual Prototyping

Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

BLOG Jun 21, 2023/5 min read

BLOG

Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

By Dermott Lynch

Tags: Multi-Die, Design, About Synopsys, Design Technology Co-Optimization, Blog

Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads

BLOG Jun 13, 2023/4 min read

BLOG

Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads

By Andy Tai, Ramesh Narayanaswamy

Tags: Multi-Die, Design, About Synopsys, Physical Implementation, Signoff, HPC, Data Center, Blog, Verification

How Multi-Die Systems Will Change Semiconductor Design

BLOG May 25, 2023/26 min read

BLOG

How Multi-Die Systems Will Change Semiconductor Design

By Synopsys Editorial Staff

Tags: Multi-Die, Engineering Central

BLOG May 23, 2023/6 min read

BLOG

How Multi-Die Systems Transform the Semiconductor Industry

By Shekhar Kapoor

Tags: Multi-Die, About Synopsys, Blog

BLOG May 22, 2023/4 min read

BLOG

Designing Thermal Management Solutions for Multi-Die Systems

By Synopsys Editorial Staff

Tags: Multi-Die, About Synopsys, Blog

BLOG May 18, 2023/6 min read

BLOG

How Semiconductor Companies Use Multi-Die Systems

By Shekhar Kapoor

Tags: Multi-Die, About Synopsys, Blog

BLOG Apr 26, 2023/6 min read

BLOG

Celebrating the 76th Anniversary of the Transistor

By Victor Moroz, Rob Aitken

Tags: Multi-Die, About Synopsys, Blog

BLOG Apr 25, 2023/7 min read

BLOG

Upgrading 3DIC Packaging for Faster AI Inference with PSMC

By Kenneth Larsen

Tags: Multi-Die, Design, About Synopsys, Blog

SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World

BLOG Apr 13, 2023/5 min read

BLOG

SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World

By Rob van Blommestein

Tags: Multi-Die, AI & Machine Learning, Silicon Lifecycle Management, Test, Design, About Synopsys, Blog, Verification

UCIe Standard: Benefits & Requirements Explained

BLOG Apr 11, 2023/4 min read

BLOG

UCIe Standard: Benefits & Requirements Explained

By Manuel Mota

Tags: Multi-Die, About Synopsys, Interface IP, Blog, Silicon IP

Discovering the Future of Multi-Die Systems

BLOG Mar 31, 2023/4 min read

BLOG

Discovering the Future of Multi-Die Systems

By Shekhar Kapoor

Tags: Multi-Die, About Synopsys, Blog

UCIe PHY IP Tape-Out on TSMC N3E Process

BLOG Mar 17, 2023/4 min read

BLOG

UCIe PHY IP Tape-Out on TSMC N3E Process

By Manuel Mota

Tags: Multi-Die, About Synopsys, Blog, Silicon IP

BLOG Feb 22, 2023/3 min read

BLOG

What are Multi-Die Systems?

By Shekhar Kapoor

Tags: Multi-Die, About Synopsys, Blog

Boosting Chip Design & Verification with AI EDA Tools

BLOG Feb 07, 2023/5 min read

BLOG

Boosting Chip Design & Verification with AI EDA Tools

By Shankar Krishnamoorthy

Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, Blog, Verification

How Systems of Chips Take Us From Smart to Smarter

BLOG Jan 19, 2023/4 min read

BLOG

How Systems of Chips Take Us From Smart to Smarter

By Shankar Krishnamoorthy

Tags: Multi-Die, AI & Machine Learning, About Synopsys, Blog

Why 2023 Holds Big Promise for Multi-Die Systems

BLOG Jan 17, 2023/5 min read

BLOG

Why 2023 Holds Big Promise for Multi-Die Systems

By Shekhar Kapoor, Michael Posner

Tags: Multi-Die, About Synopsys, Blog

3 Key Technologies that Will Transform Electronic Design in 2023

BLOG Jan 03, 2023/6 min read

BLOG

3 Key Technologies that Will Transform Electronic Design in 2023

By Sanjay Bali

Tags: Cloud, Multi-Die, Silicon Lifecycle Management, Design, 3DIC Design, About Synopsys, Blog

BLOG Dec 19, 2022/10 min read

BLOG

2022's EDA & Chip Design Advancements

By Synopsys Editorial Staff

Tags: Multi-Die, AI & Machine Learning, Prototyping, Emulation, About Synopsys, Interface IP, Blog, Cloud, Design, Automotive, HPC, Data Center, Silicon IP, Verification

How 3DICs Are Sparking a New Wave of Product Innovation

BLOG Aug 22, 2022/5 min read

BLOG

How 3DICs Are Sparking a New Wave of Product Innovation

By Shekhar Kapoor

Tags: Multi-Die, About Synopsys, Blog

Multi-Chip Module Packaging Types for Multi-Die Designs

BLOG Jul 26, 2022/6 min read

BLOG

Multi-Chip Module Packaging Types for Multi-Die Designs

By Manuel Mota

Tags: Multi-Die, About Synopsys, Blog, Silicon IP

Enhancing Chip Verification with AI and Machine Learning

BLOG Jul 12, 2022/4 min read

BLOG

Enhancing Chip Verification with AI and Machine Learning

By Rob van Blommestein

Tags: Multi-Die, Static Verification, AI & Machine Learning, Debug, Simulation, About Synopsys, HPC, Data Center, Blog, Verification, Formal Verification

BLOG Jul 11, 2022/5 min read

BLOG

What is a SmartNIC?

By Rita Horner

Tags: Multi-Die, AI & Machine Learning, Design, 3DIC Design, Security IP, About Synopsys, Foundation IP, HPC, Data Center, Blog, Silicon IP, Verification

Data Center Journey: Data Volume Growth & Moore's Law

BLOG Jun 16, 2022/6 min read

BLOG

Data Center Journey: Data Volume Growth & Moore's Law

By Mike Gianfagna

Tags: Multi-Die, AI & Machine Learning, About Synopsys, 5G Wireless, HPC, Data Center, Blog

BLOG Feb 16, 2022/6 min read

BLOG

How to Design SoCs for the SysMoore Era

By Dr. Ming Zhang

Tags: Multi-Die, AI & Machine Learning, Design, 3DIC Design, About Synopsys, Blog

Hyper-Convergent Chip Designs: News & Trends

BLOG Dec 15, 2021/2 min read

BLOG

Hyper-Convergent Chip Designs: News & Trends

By Synopsys Editorial Staff

Tags: Multi-Die, Design, About Synopsys, HPC, Data Center, Blog

What is Democratized Design? - Chip Design Process

BLOG Nov 29, 2021/4 min read

BLOG

What is Democratized Design? - Chip Design Process

By Synopsys Editorial Staff

Tags: Multi-Die, Design, About Synopsys, Blog

High-Performance Computing Drives Demand for Chiplets

BLOG Sep 14, 2021/5 min read

BLOG

High-Performance Computing Drives Demand for Chiplets

By Kenneth Larsen

Tags: Multi-Die, Design, About Synopsys, Interface IP, HPC, Data Center, Blog, Silicon IP

BLOG Aug 09, 2021/5 min read

BLOG

What is a Multi-Die Chip Design?

By Kenneth Larsen, Manuel Mota

Tags: Multi-Die, Design, About Synopsys, Interface IP, Blog, Silicon IP

3DIC Design Optimization for Power, Performance & Area

BLOG Jul 13, 2021/6 min read

BLOG

3DIC Design Optimization for Power, Performance & Area

By Kenneth Larsen

Tags: Multi-Die, Design, About Synopsys, Blog

Die-to-Die Interfaces for Data Centers Bandwidth & Latency

BLOG Jun 02, 2021/5 min read

BLOG

Die-to-Die Interfaces for Data Centers Bandwidth & Latency

By Manuel Mota

Tags: Multi-Die, About Synopsys, Interface IP, HPC, Data Center, Blog, Silicon IP

Library Characterization Tool for Advanced Node SoC Design

BLOG Apr 20, 2021/3 min read

BLOG

Library Characterization Tool for Advanced Node SoC Design

By Umang Doshi

Tags: Multi-Die, Design, About Synopsys, Signoff, Blog

PrimeSim Continuum's Enables IC Hyperconvergence

BLOG Apr 19, 2021/5 min read

BLOG

PrimeSim Continuum's Enables IC Hyperconvergence

By Tom Hsieh

Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, Blog

FPGA Prototyping Powers the SoC Design & Verification Process

BLOG Apr 14, 2021/4 min read

BLOG

FPGA Prototyping Powers the SoC Design & Verification Process

By Johannes Stahl

Tags: Multi-Die, AI & Machine Learning, Prototyping, Design, About Synopsys, 5G Wireless, Blog, Verification

Integrated Chip Design Tools for IC Hyperconvergence

BLOG Apr 06, 2021/4 min read

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Integrated Chip Design Tools for IC Hyperconvergence

By Raja Tabet, Anand Thiruvengadam

Tags: Multi-Die, AI & Machine Learning, Design, About Synopsys, HPC, Data Center, Blog, Silicon IP

How 3DIC Design Tools Enhance Productivity & Performance

BLOG Mar 03, 2021/5 min read

BLOG

How 3DIC Design Tools Enhance Productivity & Performance

By Shekhar Kapoor, Kenneth Larsen

Tags: Multi-Die, Design, 3DIC Design, About Synopsys, Blog

Die-to-Die Connectivity for High-Performance Computing

BLOG Nov 30, 2020/7 min read

BLOG

Die-to-Die Connectivity for High-Performance Computing

By Scott Durrant

Tags: Multi-Die, About Synopsys, HPC, Data Center, Blog, Silicon IP

Defining the AI Era with the IBM Research AI Hardware Center

BLOG Oct 19, 2020/4 min read

BLOG

Defining the AI Era with the IBM Research AI Hardware Center

By Arun Venkatachar

Tags: Multi-Die, AI & Machine Learning, 3DIC Design, Emulation, About Synopsys, Interface IP, Blog, Virtual Prototyping, Design, Manufacturing, Design Technology Co-Optimization, Silicon IP, Verification

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