Sep 21, 2023/4 min read Samsung Foundry and Synopsys Accelerate Multi-Die System Design By Henry Sheng, Jennifer Pyon Tags: Multi-Die System, Product Spotlight, Design
Sep 12, 2023/6 min read Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems By Filip Thoen, Leonard Drucker, Vivek Prasad Tags: Multi-Die System, Verification
Aug 22, 2023/4 min read Addressing Multi-Physics Effects for High-Performing Multi-Die Systems By Shekhar Kapoor, Kenneth Larsen Tags: Multi-Die System, Design
Aug 03, 2023/7 min read Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications By Jigesh Patel, Kenneth Larsen, Ian Land Tags: Multi-Die System, Aerospace & Government, Photonic
Aug 01, 2023/5 min read Key Considerations for Addressing Multi-Die System Verification Challenges By Arturo Salz, Dr. Johannes Stahl Tags: Multi-Die System, Verification
Jul 24, 2023/4 min read New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems By Taruna Reddy Tags: Multi-Die System, Verification
Jun 28, 2023/7 min read Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools By Dr. Johannes Stahl, Tim Kogel Tags: Multi-Die System, Design
Jun 21, 2023/5 min read Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems By Dermott Lynch Tags: Multi-Die System, Design Technology Co-Optimization
Jun 13, 2023/4 min read Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads By Andy Tai, Ramesh Narayanaswamy Tags: Multi-Die System, HPC, Data Center, Verification
May 23, 2023/5 min read How Multi-Die Systems Transform the Semiconductor Industry By Synopsys Editorial Staff Tags: Multi-Die System
May 22, 2023/4 min read Designing Thermal Management Solutions for Multi-Die Systems By Synopsys Editorial Staff Tags: Multi-Die System
May 18, 2023/5 min read How Semiconductor Companies Use Multi-Die Systems By Synopsys Editorial Staff Tags: Multi-Die System
Apr 26, 2023/6 min read Celebrating the 76th Anniversary of the Transistor By Victor Moroz, Rob Aitken Tags: Multi-Die System
Apr 25, 2023/7 min read Upgrading 3DIC Packaging for Faster AI Inference with PSMC By Kenneth Larsen Tags: Multi-Die System, AI & Machine Learning, Design
Apr 13, 2023/5 min read SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World By Synopsys Editorial Staff Tags: Multi-Die System, AI & Machine Learning, Inside Synopsys
Apr 11, 2023/4 min read UCIe Standard: Benefits & Requirements Explained By Manuel Mota Tags: Multi-Die System, Silicon IP
Mar 31, 2023/3 min read Discovering the Future of Multi-Die Systems By Synopsys Editorial Staff Tags: Multi-Die System
Mar 17, 2023/3 min read UCIe PHY IP Tape-Out on TSMC N3E Process By Manuel Mota Tags: Multi-Die System, Silicon IP
Jan 19, 2023/4 min read How Systems of Chips Take Us From Smart to Smarter By Shankar Krishnamoorthy Tags: Multi-Die System, AI & Machine Learning
Jan 17, 2023/5 min read Why 2023 Holds Big Promise for Multi-Die Systems By Shekhar Kapoor, Michael Posner Tags: Multi-Die System
Jan 03, 2023/6 min read 3 Key Technologies that Will Transform Electronic Design in 2023 By Sanjay Bali Tags: Cloud, Multi-Die System
Dec 19, 2022/10 min read 2022's EDA & Chip Design Advancements By Synopsys Editorial Staff Tags: Cloud, Multi-Die System, AI & Machine Learning, HPC, Data Center, Silicon IP, Inside Synopsys
Aug 22, 2022/5 min read How 3DICs Are Sparking a New Wave of Product Innovation By Shekhar Kapoor Tags: Multi-Die System
Jul 31, 2022/6 min read How Universal Chiplet Interconnect Express Changes SoC Design By Manuel Mota Tags: Multi-Die System, AI & Machine Learning, HPC, Data Center, Silicon IP
Jul 26, 2022/6 min read Multi-Die Chip Design: Multi-Chip Module Packaging Types By Manuel Mota Tags: Multi-Die System, AI & Machine Learning, HPC, Data Center, Silicon IP
Jul 12, 2022/4 min read Enhancing Chip Verification with AI & Machine Learning By Rob van Blommestein Tags: Multi-Die System, AI & Machine Learning, Product Spotlight, HPC, Data Center, Verification
Jul 11, 2022/5 min read What is a SmartNIC? By Rita Horner Tags: Multi-Die System, AI & Machine Learning, HPC, Data Center
Feb 16, 2022/6 min read How to Design SoCs for the SysMoore Era By Dr. Ming Zhang Tags: Multi-Die System, AI & Machine Learning, Design
Dec 15, 2021/2 min read Hyper-Convergent Chip Designs: News & Trends By Synopsys Editorial Staff Tags: Multi-Die System, Design, HPC, Data Center
Nov 29, 2021/4 min read What is Democratized Design? - Chip Design Process By Mike Gianfagna Tags: Multi-Die System, Design
Sep 14, 2021/5 min read High-Performance Computing Drives Demand for Chiplets By Kenneth Larsen Tags: Multi-Die System, Design, HPC, Data Center
Aug 09, 2021/5 min read What is a Multi-Die Chip Design? By Kenneth Larsen, Manuel Mota Tags: Multi-Die System, Silicon IP
Jul 13, 2021/5 min read 3DIC Design Optimization for Power, Performance & Area By Kenneth Larsen Tags: Multi-Die System, Design, HPC, Data Center
Apr 20, 2021/3 min read Library Characterization Tool for Advanced Node SoC Design By Umang Doshi Tags: Multi-Die System, Product Spotlight, Verification
Apr 19, 2021/5 min read PrimeSim Continuum's Enables IC Hyperconvergence By Tom Hsieh Tags: Multi-Die System, AI & Machine Learning, Product Spotlight, Verification
Apr 14, 2021/4 min read FPGA Prototyping Powers the SoC Design & Verification Process By Dr. Johannes Stahl Tags: Multi-Die System, AI & Machine Learning, Product Spotlight, Design, Verification
Mar 03, 2021/5 min read How 3DIC Design Tools Enhance Productivity & Performance By Shekhar Kapoor, Kenneth Larsen Tags: Multi-Die System, Design