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Multi-Die

Our Multi-Die System experts share insights to help you navigate through the challenges of heterogeneous integration to deliver systems for hyperscale data centers, AI, and other compute-intensive applications.

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Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

BLOG 3 min read/ Aug 07, 2025

BLOG

Simplifying AI Chip Development: Arm and Synopsys Execs Discuss Chiplet, Subsystem, and IP Integration

By Frank Malloy

Tags: Multi-Die, AI & Machine Learning, Chip Design Insights, Design, Physical Implementation, Silicon IP, Verification, Virtual Prototyping

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

BLOG 3 min read/ Aug 05, 2025

BLOG

UCIe 3.0 Is Here: Synopsys IP Solutions Are Ready

By Sajani Patel, Varun Agrawal, Manuel Mota

Tags: Multi-Die, Chip Design Insights, Design, Interface IP, Silicon IP

RTL Signoff vs. Functional Signoff: What’s the Difference?

BLOG 5 min read/ Jul 01, 2025

BLOG

RTL Signoff vs. Functional Signoff: What’s the Difference?

By Bradley Geden, Manoz Palaparthi

Tags: Verification Central, Multi-Die, RTL Synthesis, Static & Formal Verification, AI & Machine Learning, Debug, Physical Verification, Test, Simulation, Energy-Efficient SoCs, Signoff, Chip Design Insights, Design, Verification, Formal Verification

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

BLOG 3 min read/ May 28, 2025

BLOG

High Bandwidth Memory (HBM) at the AI Crossroads: Customization or Standardization?

By Synopsys Editorial Staff

Tags: Verification Central, Multi-Die, AI & Machine Learning, Memory, Chip Design Insights, Design, Interface IP, Verification IP, HPC, Data Center, Silicon IP, Verification, 3DIC Design

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

BLOG 3 min read/ May 22, 2025

BLOG

Faster, More Collaborative SoC and Chiplet Architecture Exploration: Introducing Synopsys Platform Architect Development Kit (PADK)

By Kamal Desai

Tags: Verification Central, Cloud, Multi-Die, Prototyping, Chip Design Insights, Design, Verification, Virtual Prototyping

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

BLOG 4 min read/ May 15, 2025

BLOG

Multi-Die Design Challenges: Industry Leaders Provide Insights and Guidance

By Frank Malloy

Tags: Multi-Die, Chip Design Insights, Design, 3DIC Design

Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

BLOG 2 min read/ Feb 06, 2025

BLOG

Synopsys Aims to Reduce Silicon Design Cycles by up to a Year in Collaboration with Arm

By Arun Bhattacharya

Tags: Multi-Die, Chip Design Insights, Design, Interface IP, Foundation IP, Silicon IP

Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

BLOG 2 min read/ Jan 21, 2025

BLOG

Synopsys Bold Prediction: 50% of New HPC Chip Designs Will Be Multi-Die in 2025

By Shekhar Kapoor, Michael Posner

Tags: Multi-Die System, Chip Design Insights, Design, 3DIC Compiler

Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances

BLOG 5 min read/ Jan 09, 2025

BLOG

Multi-Die Health and Reliability: Synopsys and TSMC Showcase UCIe Advances

By Faisal Goriawalla, Yervant Zorian

Tags: Multi-Die System, Silicon Lifecycle Management, Chip Design Insights, Interface IP, Silicon IP

Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

BLOG 2 min read/ Dec 05, 2024

BLOG

Collaboration for Innovation: How Synopsys and TSMC are Advancing Chip Design

By Synopsys Editorial Staff

Tags: Multi-Die, Chip Design Insights, Design, Manufacturing, Foundation IP, HPC, Data Center, Silicon IP, 3DIC Design

Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs

BLOG 4 min read/ Sep 09, 2024

BLOG

Synopsys Introduces Industry’s First 40G UCIe IP Solution to Power High-Performance Multi-Die Designs

By Manuel Mota

Tags: Multi-Die, Chip Design Insights, Interface IP, Silicon IP

UCIe 2.0 - Setting the Tone for Chiplet Interoperability

BLOG 3 min read/ Aug 08, 2024

BLOG

UCIe 2.0 - Setting the Tone for Chiplet Interoperability

By Prasad Subudhi K. S, Deepak Nagaria, Narasimha Babu G V L

Tags: Verification Central, Multi-Die, Verification IP, Verification

Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

BLOG 4 min read/ Jun 17, 2024

BLOG

Synopsys and Alchip Collaborate to Streamline the Path to Multi-die Success with Soft Chiplets

By Manmeet Walia, Erez Shaizaf, Manuel Mota

Tags: Multi-Die, Chip Design Insights

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

BLOG 5 min read/ Jun 12, 2024

BLOG

GUC Leverages 3DIC Compiler to Enable 2.5D/3D Multi-Die Package

By Synopsys Editorial Staff, WeiHsun Liao

Tags: Customer Spotlight, Multi-Die, Chip Design Insights, Design, 3DIC Design

Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

BLOG 3 min read/ Apr 25, 2024

BLOG

Want to Mix and Match Dies in a Single Package? UCIe Can Get You There

By Michael Posner, Manuel Mota

Tags: Multi-Die, Chip Design Insights, Interface IP, Silicon IP

Faster, Higher Capacity Emulation and Prototyping for AI Workloads

BLOG 4 min read/ Mar 20, 2024

BLOG

Faster, Higher Capacity Emulation and Prototyping for AI Workloads

By Samskrut Konduru

Tags: Multi-Die, AI & Machine Learning, Product Spotlight, Prototyping, Chip Design Insights, Emulation, Verification

Industry Leaders Discuss “Overcoming the Challenges of Multi-die Systems Verification”

BLOG 8 min read/ Mar 15, 2024

BLOG

Industry Leaders Discuss “Overcoming the Challenges of Multi-die Systems Verification”

By Verification Expert

Tags: Verification Central, Multi-Die System, Verification

Industry's First Verification IP for Arm AMBA CHI-G

BLOG 5 min read/ Mar 06, 2024

BLOG

Industry's First Verification IP for Arm AMBA CHI-G

By Sudhanshu Rao

Tags: Verification Central, Multi-Die, Verification IP, Verification

Synopsys AMBA CHI C2C System Verification Solutions

BLOG 5 min read/ Feb 22, 2024

BLOG

Synopsys AMBA CHI C2C System Verification Solutions

By Venkatesh Kudumula

Tags: Verification Central, Multi-Die, Verification IP, Verification

Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology

BLOG 4 min read/ Jan 23, 2024

BLOG

Avoiding Multi-Die System Re-spins with New Early Architecture Exploration Technology

By Kamal Desai

Tags: Multi-Die, Chip Design Insights, Design, Platform

Can 3DHI Meet the Demands of Aerospace and Government Applications?

BLOG 5 min read/ Jan 22, 2024

BLOG

Can 3DHI Meet the Demands of Aerospace and Government Applications?

By Kenneth Larsen, Ian Land, Rob Aitken

Tags: Multi-Die, Aerospace & Government, Chip Design Insights, Design

2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation

BLOG 8 min read/ Dec 20, 2023

BLOG

2023 in Review: AI Takes Center Stage in the Eternal Quest for Innovation

By Synopsys Editorial Staff

Tags: Cloud, Multi-Die, AI & Machine Learning, Chip Design Insights

Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip

BLOG 4 min read/ Dec 14, 2023

BLOG

Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip

By Manuel Mota

Tags: Multi-Die, Chip Design Insights, Interface IP, Silicon IP

What’s Next for Multi-Die Systems in 2024?

BLOG 5 min read/ Dec 13, 2023

BLOG

What’s Next for Multi-Die Systems in 2024?

By Shekhar Kapoor

Tags: Multi-Die, Chip Design Insights

How Photonics Can Light the Way for Higher Performing Multi-Die Systems

BLOG 5 min read/ Nov 21, 2023

BLOG

How Photonics Can Light the Way for Higher Performing Multi-Die Systems

By Kenneth Larsen, Twan Korthorst

Tags: Multi-Die, Chip Design Insights, Design, Photonic

Ensuring the Health and Reliability of Multi-Die Systems

BLOG 7 min read/ Oct 11, 2023

BLOG

Ensuring the Health and Reliability of Multi-Die Systems

By Randy Fish, Yervant Zorian, Manuel Mota, Guy Cortez

Tags: Multi-Die, AI & Machine Learning, Chip Design Insights, Design, HPC, Data Center

Industry Insights: How Collaboration Will Accelerate Adoption of Multi-Die Systems

BLOG 6 min read/ Oct 04, 2023

BLOG

Industry Insights: How Collaboration Will Accelerate Adoption of Multi-Die Systems

By Synopsys Editorial Staff

Tags: Multi-Die, Chip Design Insights

Samsung Foundry and Synopsys Accelerate Multi-Die System Design

BLOG 4 min read/ Sep 21, 2023

BLOG

Samsung Foundry and Synopsys Accelerate Multi-Die System Design

By Henry Sheng, Jennifer Pyon

Tags: Multi-Die, Product Spotlight, Chip Design Insights, Design

Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems

BLOG 7 min read/ Sep 12, 2023

BLOG

Five Key Techniques to Accelerate Software Bring-Up for Multi-Die Systems

By Filip Thoen, Leonard Drucker, Vivek Prasad

Tags: Multi-Die, Chip Design Insights, Verification

Addressing Multi-Physics Effects for High-Performing Multi-Die Systems

BLOG 4 min read/ Aug 22, 2023

BLOG

Addressing Multi-Physics Effects for High-Performing Multi-Die Systems

By Shekhar Kapoor, Kenneth Larsen

Tags: Multi-Die, Chip Design Insights, Design

Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications

BLOG 8 min read/ Aug 03, 2023

BLOG

Embracing Multi-Die Systems and Photonics for Aerospace and Government Applications

By Jigesh Patel, Kenneth Larsen, Ian Land

Tags: Multi-Die, Aerospace & Government, Chip Design Insights, Photonic

Key Considerations for Addressing Multi-Die System Verification Challenges

BLOG 6 min read/ Aug 01, 2023

BLOG

Key Considerations for Addressing Multi-Die System Verification Challenges

By Arturo Salz, Johannes Stahl

Tags: Multi-Die, Chip Design Insights, Verification

New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems

BLOG 4 min read/ Jul 24, 2023

BLOG

New Distributed Simulation Technology for Faster Simulation of Multi-Die Systems

By Taruna Reddy

Tags: Multi-Die, Chip Design Insights, Verification

Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

BLOG 7 min read/ Jun 28, 2023

BLOG

Developing the Blueprint for Multi-Die Systems with Virtual Prototyping Tools

By Johannes Stahl, Tim Kogel

Tags: Multi-Die, Chip Design Insights, Verification, Virtual Prototyping

Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

BLOG 5 min read/ Jun 21, 2023

BLOG

Designing Electrostatic Discharge (ESD) Protection for Monolithic SoCs and Multi-Die Systems

By Dermott Lynch

Tags: Multi-Die, Chip Design Insights, Design, Design Technology Co-Optimization

Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads

BLOG 4 min read/ Jun 13, 2023

BLOG

Synopsys and AMD Collaboration Achieves Significant Milestones for EDA Workloads

By Andy Tai, Ramesh Narayanaswamy

Tags: Multi-Die, Chip Design Insights, Design, Physical Implementation, Signoff, HPC, Data Center, Verification

BLOG 6 min read/ May 23, 2023

BLOG

How Multi-Die Systems Transform the Semiconductor Industry

By Shekhar Kapoor

Tags: Multi-Die, Chip Design Insights

BLOG 4 min read/ May 22, 2023

BLOG

Designing Thermal Management Solutions for Multi-Die Systems

By Synopsys Editorial Staff

Tags: Multi-Die, Chip Design Insights

BLOG 6 min read/ May 18, 2023

BLOG

How Semiconductor Companies Use Multi-Die Systems

By Shekhar Kapoor

Tags: Multi-Die, Chip Design Insights

BLOG 6 min read/ Apr 26, 2023

BLOG

Celebrating the 76th Anniversary of the Transistor

By Victor Moroz, Rob Aitken

Tags: Multi-Die, Chip Design Insights

BLOG 7 min read/ Apr 25, 2023

BLOG

Upgrading 3DIC Packaging for Faster AI Inference with PSMC

By Kenneth Larsen

Tags: Multi-Die, Chip Design Insights, Design

SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World

BLOG 5 min read/ Apr 13, 2023

BLOG

SNUG Silicon Valley 2023: Catalyzing the Future for Our Smart Everything World

By Rob van Blommestein

Tags: Multi-Die, AI & Machine Learning, Silicon Lifecycle Management, Test, Chip Design Insights, Design, Verification, Inside Synopsys

UCIe Standard: Benefits & Requirements Explained

BLOG 4 min read/ Apr 11, 2023

BLOG

UCIe Standard: Benefits & Requirements Explained

By Manuel Mota

Tags: Multi-Die, Chip Design Insights, Interface IP, Silicon IP

Discovering the Future of Multi-Die Systems

BLOG 4 min read/ Mar 31, 2023

BLOG

Discovering the Future of Multi-Die Systems

By Shekhar Kapoor

Tags: Multi-Die, Chip Design Insights

UCIe PHY IP Tape-Out on TSMC N3E Process

BLOG 4 min read/ Mar 17, 2023

BLOG

UCIe PHY IP Tape-Out on TSMC N3E Process

By Manuel Mota

Tags: Multi-Die, Chip Design Insights, Silicon IP

BLOG 3 min read/ Feb 22, 2023

BLOG

What are Multi-Die Systems?

By Shekhar Kapoor

Tags: Multi-Die, Chip Design Insights

Boosting Chip Design & Verification with AI EDA Tools

BLOG 5 min read/ Feb 07, 2023

BLOG

Boosting Chip Design & Verification with AI EDA Tools

By Shankar Krishnamoorthy

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Verification

How Systems of Chips Take Us From Smart to Smarter

BLOG 4 min read/ Jan 19, 2023

BLOG

How Systems of Chips Take Us From Smart to Smarter

By Shankar Krishnamoorthy

Tags: Multi-Die, AI & Machine Learning, Chip Design Insights

Why 2023 Holds Big Promise for Multi-Die Systems

BLOG 5 min read/ Jan 17, 2023

BLOG

Why 2023 Holds Big Promise for Multi-Die Systems

By Shekhar Kapoor, Michael Posner

Tags: Multi-Die, Chip Design Insights

3 Key Technologies that Will Transform Electronic Design in 2023

BLOG 6 min read/ Jan 03, 2023

BLOG

3 Key Technologies that Will Transform Electronic Design in 2023

By Sanjay Bali

Tags: Cloud, Multi-Die, Silicon Lifecycle Management, Chip Design Insights, Design, 3DIC Design

BLOG 10 min read/ Dec 19, 2022

BLOG

2022's EDA & Chip Design Advancements

By Synopsys Editorial Staff

Tags: Multi-Die, AI & Machine Learning, Prototyping, Emulation, Interface IP, Inside Synopsys, Cloud, Chip Design Insights, Design, Automotive, HPC, Data Center, Silicon IP, Verification