HPC applications are swimming in petabytes of data (and growing), and the data itself is also becoming more complex. To generate the insights and outcomes anticipated from these applications—and often, in real time—hyperscale data centers require server chips that can support the capacity while delivering blazingly fast processing speeds. In many cases, monolithic SoCs are not sufficient, leading hyperscalers turn to multi-die systems. Delivering heterogeneous integration of dies in a single package, a multi-die system provides efficient scaling of system functionality, as well as reduced risk and time to market, lower power, and faster creation of product variants. From a verification standpoint, a multi-die system is simply that much more massive in size, requiring a speed-up in the process and leading-edge distribution technologies to effectively partition and ensure aggressive time-to-market goals are met.
AMD EPYC 9004 Series processors are one of the highest performance server processors for technical computing, handling workloads including EDA, computational fluid dynamics (CFD), and finite element analysis (FEA). The CPUs are built on 3D die stacking architecture — known as AMD 3D V-Cache — with copper-to-copper bonds (no solder bumps) on a 5nm process technology. With more than 200x the interconnect densities of typical 2D CPU technologies, the processors are designed to relieve memory bandwidth pressure and reduce latency. AMD 3D V-Cache technology provides dramatic, out-of-the-box performance uplifts across an array of workloads, including commercial HPC applications.
“Chip designers continue to face a trifecta of challenges stemming from the demands of data-intensive applications, including greater performance, more energy efficiency, and lower costs for their essential technical compute workloads,” said Shankar Krishnamoorthy, GM of the EDA Group at Synopsys. “Our longstanding collaboration with AMD delivers performance optimization of Synopsys flows, capitalizing on AMD EPYC processors with 3D V-Cache technology to enable the faster turnaround times our customers need to accelerate their time to market.”
“4th Gen AMD EPYC processors with AMD 3D V-Cache technology build on AMD technical computing leadership, providing the design and packaging technology needed to address demanding CFD, FEA, and EDA workloads,” said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. “With our AMD 3D V-Cache technology, customers can take advantage of the 4th Gen AMD EPYC processor’s leadership performance and energy efficiency to enhance the productivity of the teams running complex design, verification, and simulation, driving faster time to market for new products and technologies.”