Synopsys Die-to-Die IP Solutions

<p>Synopsys’ complete Die-to-Die IP solution includes 112G XSR and UCIe controllers and PHYs, with leading power, latency and die edge efficiency, for high-performance computing SoCs. The solution also includes HBI/AIB PHY. Synopsys UCIe IP, supporting standard and advanced packaging technologies, delivers up to 4Tbps bandwidth in a multi-module configuration. The UCIe controller enables an ultra-low latency link between two dies based on popular protocols and for compute-to-compute and compute-to-IO connectivity.&nbsp;Synopsys 112G XSR IP leverages high-speed SerDes technology up to 112G per lane for ultra and extra short reach links. The XSR controller includes a highly optimized FEC for a reliable, low latency link between two dies.&nbsp;Synopsys HBI/AIB PHY, supporting the AIB 2.0 standard, leverages wide-parallel bus technology and delivers 4Gbps per pin die-to-die connectivity with low latency.</p>

Overview

Synopsys offers a complete IP solution for die-to-die connectivity, including UCIe and 112G XSR controllers and PHYs as well as AIB PHY, for multi-die systems targeting high-performance computing and automotive applications. The UCIe IP (supporting v1.1 and v1.0) delivers power and die-edge efficiency, low-latency, support for standard and advanced packaging technologies, and up to 4Tbps bandwidth in a multi-module configuration. The UCIe controller enables an ultra-low latency link between dies based on popular protocols to ensure interoperability. It also enables specialized lightweight bridges over UCIe streaming protocols for a seamless connection between SoCs and NoCs. Synopsys 112G XSR IP leverages high-speed SerDes technology for extra short reach links. The XSR controller includes a highly optimized FEC for a reliable, low latency link between dies. Synopsys AIB2.0 PHY leverages wide-parallel bus technology and delivers 4Gbps per pin die-to-die connectivity with low latency in AIB-based multi-die systems.