For instance, splitting the die into multiple homogeneous dies (same functionality in each die) reduces the size of individual dies, improving the fabrication yield and providing greater product flexibility.
On the other hand, integrating heterogeneous dies enables the use of process technologies that are cost- and performance- optimized for the implemented function. For example, analog and RF functions do not take advantage of process scaling and are more efficiently implemented in older nodes.
In the cloud computing and HPC space, there is heavy use in scaling devices (a homogeneous application). As you scale circuitry within a package, you may use several homogeneous dies in a package to get higher performance. However, in applications such as edge computing, 5G, and IoT devices, performance scaling is less important than reducing size and cost. In those cases, heterogeneous die applications are more popular.
In addition, the packaging of MCM is evolving, which allows designers to choose from options that best suit their needs. Using organic substrates, interposers, and wafer-level packaging enables low-cost, low-density connection between dies with a conservative amount of I/Os. Silicon interposers are a more expensive and complex alternative, but allow for a very high-density connection between dies.