New use cases are emerging for die-to-die connectivity in MCMs, some of which include:
1. High-performance computing and server SoCs approaching maximum reticle sizes
2. Ethernet switches and networking SoCs exceeding maximum reticle sizes
3. Artificial intelligence (AI) SoCs with distributed SRAMs to scale complex algorithms
High-performance computing and server SoCs are becoming large in size, reaching 550 squared millimeters (mm2) to 800 mm2, diminishing the SoC yield and increasing the cost per die. A better approach to optimizing SoC yield is to split the SoC into two or multiple equivalent homogenous dies, as shown in Figure 1, and connecting the dies using a die-to-die PHY IP. The key requirements in such a use case are extremely low latency and zero bit-error rate since the smaller dies must depict and behave as a single die.