From the impact of artificial intelligence (AI) to the emergence of multi-die systems, the semiconductor industry has experienced wave after wave of innovation to stretch the limits of Moore’s law. During his talk, de Geus noted that we are at the intersection of silicon and software, in a new era of systemic and scale complexity, which he calls the SysMoore era. Hunger for connectivity and data, driven by demand for Smart Everything, has created the need for better, faster, and cheaper silicon chips.
“Making it all work will be the challenge of us as a big team,” he said. “We will need to deliver 1000x in productivity just in this decade. Every different vertical will create their own architecture, and implementation will look like a ‘Manhattan’ construction of more and more chips extremely close together.”
Recognizing the significant contributions of the late Gordon Moore, who passed away on March 24, de Geus noted that following Moore’s law—the essence of the semiconductor industry—has driven an exponential rate of change for human history. While Moore’s law has slowed, it is still advancing at a tremendous pace. Indeed, thanks to engineering ingenuity, the semiconductor industry is pushing ahead to angstrom-level scaling, transistor-rich architectures like multi-die systems, and AI integration.
Synopsys’ first entry into AI-driven chip design was Synopsys DSO.ai™, which was launched in early 2020 and recently notched its first 100 commercial tape-outs. “The first time I saw DSO.ai at work, I was blown away because I know how complex it is underneath all of this to get the results,” de Geus said. Today, all the company’s tools are optimized for machine learning (ML) and key flows have been enhanced using ML.
Multi-die systems provide a solution for compute-intensive applications like AI, integrating heterogeneous dies in a single package to deliver better power, performance, and area (PPA). Yet, compared to their monolithic counterparts, developing multi-die systems comes with unique challenges—challenges that can be met with AI-driven EDA flows, as well as the comprehensive Synopsys Multi-Die System Solution. The solution includes tools that enable early architecture exploration, fast software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and enhanced manufacturing and reliability. As multi-die systems become mainstream, having such tools in the arsenal will be critical to meeting quality, security, and time-to-market targets.