When you talk about verification of any type, speed is usually the first topic that comes to mind. PrimeSim Continuum delivers with industry-leading performance, anchored by two engines that enable unmatched throughput and capacity, alongside other integrated specialty simulation and analysis tools and productivity-enhancers.
Let’s start with the new PrimeSim SPICE and get the speed argument addressed right up front: It’s not only 3x faster than any other SPICE simulators, but it also introduces a unique performance scaling approach that enables heterogeneous compute acceleration using GPU architectures. All with no compromises in accuracy as it maintains golden signoff quality. Leveraging its unique hybrid CPU/GPU architecture, users can experience up to 10x performance scaling with golden accuracy for large post-layout designs.
Our customers acknowledge the importance of the performance benefits: “As modern compute workloads evolve, the size and complexity of analog designs have moved beyond the capacity of traditional circuit simulators. Using NVIDIA GPUs enables PrimeSim SPICE to accelerate circuit simulation, notably minimizing signoff time of analog blocks from days to hours,” said Edward Lee, vice president of Mixed-Signal Design at NVIDIA, in a news release.
Because leading-edge manufacturing architectures such as FinFETS and processes at nodes scaling to 3nm introduce new challenges from a manufacturability and yield standpoint, a comprehensive analysis environment is needed. Issues such as electrothermal stress and larger parasitics must be addressed to focus on the chip reliability that manufacturing at scale will require. PrimeSim Continuum provides a complete set of analysis capabilities to consider time domain, frequency domain, and noise.
We’ve also revved up our Fast SPICE engine to increase performance by up to 5x. A key advancement is our innovative partitioning and advanced modeling capabilities that help break down elements into manageable pieces to increase both runtime and overall capacity. The tool has proven to be capable of handling billions of elements that comprise a modern, complex 3D stacked memory design, for example, and still maintain signoff-quality accuracy.