Engineers have never been the type to back away from a good challenge. As we’ve experienced in years past and will see again in 2023, their ingenuity will continue to lead the way to powerful chips that can take on the most demanding of compute workloads. Investing in talent is a must and programs such as the Synopsys Academic & Research Alliances (SARA), which provide educational opportunities, access to advanced technologies, and collaborative support to students, educators, researchers, and entrepreneurs, can help nurture the next generation of engineers.
As new technology challenges emerge, Synopsys is primed to help design teams realize their silicon goals, whether they’re designing monolithic, energy-efficient SoCs, 2.5/3D multi-die systems, or something in between. Our full stack facilitates design, verification, testing, manufacturing, silicon lifecycle management, and software security.
While no one can really predict the future, we can see the trends and patterns that may shape the coming year. AI and big data analytics are becoming more prevalent in our everyday lives (and even in chip design), while cars are being infused with greater levels of intelligence. Hyperscalers are demanding more from their chips to find solutions to problems as vast as vaccine discovery, grid-scale energy storage, and world hunger—and in doing so, they’re shaping the chip industry itself. Multi-die systems are fast becoming an answer to the slowing of Moore’s law, and with these architectures come greater opportunity to deliver what our data-driven, bandwidth-hungry world needs.
It’s a transformative time in the electronics industry, as we see chips playing a critical role in innovations that are tackling some of the world’s biggest challenges. The three key technologies anticipated to make a big mark in 2023—silicon lifecycle management, the cloud, and multi-die systems—are primed to move the momentum toward a smarter, more equitable world.