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Multiphysics Fusion Technology for Multi-Die Designs Explained
Multiphysics Fusion Technology for Multi-Die Designs Explained

Unified multiphysics fusion helps multi-die teams validate earlier and sign off faster.

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Mike Gianfagna

Mike Gianfagna has an extensive background in the semiconductor and electronic design automation industries. He has a B.S. in electrical and electronics engineering from New York University and an M.S. in electrical and electronics engineering from Rutgers University.

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