Multi-die systems have enabled chip designers to reduce both risk and time to market. For this reason, there’s been a notable expansion in the past two to three years, which is a far cry from the sporadic use across the industry in the past. During the panel, Samsung’s Park weighed in on key segments emerging in the multi-die system landscape.
“Adoption started mainly from high-performance computing (HPC),” said Park. “Now, we have folks in the mobile and automotive units that are seriously thinking of bringing those multi-die systems into those application spaces. What it really means is that the portfolio of technology and adoption of technology is expanding very fast. As a manufacturer and enabler in the market, we are really happy to see the ecosystem of multi-die systems expanding.”
Ansys’ Becer noted substantial growth in 3DIC design over the last year, forecasting even more growth in the future. He also touched on heterogeneous integration, a significant driver for adopting multi-die systems.
“The forecast for 3DIC is continuing to accelerate," said Becer. "In fact, we are seeing around a 3X increase in the number of 3DIC design starts this year versus last year, which means 3DIC is here to stay. One of the major benefits that influences further adoption is enabling heterogeneous integration. You can choose the best technology for each chiplet, meaning that you can bring in an analog, mixed-signal, or RF chiplet or you can use an older, more mature, or lower power node.”
Synopsys’ Kapoor echoed the sentiment of rapid growth within multi-die systems use, noting that Synopsys has seen a definitive increase in the usage of multi-die system designs, currently tracking over 100 multi-die system projects in the industry, spanning various package types and applications.