Designing the Future: How 3DIC Compiler Is Powering Breakthroughs Across the MultiDie Design Landscape

One of the world’s most advanced compute innovators recently completed a multi-die design that stretched the limits of what engineering teams previously believed possible. Their AI accelerator, built to power future high-performance computing architectures, integrated tens of chiplets, dozens HBM stacks, and multiple largescale silicon bridges across an interposer. The system required managing up to ten million bumps and coordinating layers of 3D stacking.

Before adopting Synopsys’ 3DIC Compiler platform, the team relied on a highly manual process, using spreadsheets to track connectivity and intricate routing decisions. This approach was simply not sustainable. The combination of advanced memory interfaces, multi-die synchronization, tight shielding requirements, and elaborate die- to-die routing created scalability challenges. Signal integrity issues multiplied as interconnects grew. Turnaround times began to exceed acceptable limits, threatening product milestones.

3DIC Compiler fundamentally redefined their flow. Instead of stitching together data by hand, the team moved to an automated construction pipeline that performed intelligent bump and TSV planning and 3D system assembly. What once required days of manual iteration became a fluid process of in-design analysis, enabling engineers to explore architecture options with real time feedback. The platform’s 3D channel auto-routing capabilities handled HBM and UCIe routing scenarios that previously demanded extensive manual adjustment, while integrated SI engines validated signal quality at every step. Even the most complex high speed differential paths and Fan‑Out Redistribution Layer (FORDL) structures could be routed and verified within 3DIC Compiler platform’s unified environment.

This transformation allowed the team to tape out the design on schedule, despite its unprecedented scope. For their engineers, 3DIC Compiler allowed them to focus on optimization. It proved that even the industry’s most ambitious multi-die design could be executed quickly, predictably, and at scale. 

Another organization, among the world’s most influential cloud technology providers, recently approached multi-die design for the first time. Their initial project introduced them to the intricacies of HBM-based systems, multiple unique memory stacks, angled routing geometries, and a dense array of die-to-die channels that required precision. The company encountered challenges with multi-die signal integrity validation, 3D assembly, and die-to-die routing. This created an environment where uncertainty could easily translate into risk.

Validating SI quality across dozens of channels required massive runtime with their existing traditional manual and siloed approach between layout and SI teams, making it nearly impossible to confirm behavior reliably. Routing through multiple 45-degree waterfalls across several HBM stacks added further difficulty. Because multi-die design introduces new set of challenges, across timing, electromigration, thermal interactions, and more, the company needed a platform that could streamline the process while ensuring the integrity of the design. 

3DIC Compiler became that platform. It provided them with a guided workflow that made multi-die design feel approachable rather than overwhelming. Automated 3D construction offered immediate insight into system-level topology. The auto-routing engine handled complicated angled and shielded geometries with ease, giving engineers confidence in the physical implementation. Most importantly, native SI analysis allowed the team to validate routing quality as they progressed, rather than saving it for late-stage signoff. It shortened channel equivalence testing on over a hundred nets from weeks to days, enabling a timely and confident tape out with reliable die-to-die routing. They could now see, in real time, how changes influenced signal behavior across multiple HBM and UCIe channels.

The company achieved not only a working product but also institutional knowledge that will accelerate future programs.  Synopsys 3DIC Compiler provided structure, safety, and technical clarity. At an organizational level, it marked a major milestone in their evolution as a silicon developer.