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Synopsys’ acquisition of Ansys was a seismic event in the world of engineering software, unlocking an incredible range of opportunities that were simply not possible before.
These opportunities extend well beyond chip design, fueling the development of increasingly integrated and novel products — like advanced robotics and autonomous vehicles — across mechanical, thermal, fluids, safety, reliability, other engineering domains.
A mere eight months after the acquisition closed, the first Synopsys-Ansys combined solutions were unveiled at Converge 2026: Synopsys Multiphysics Fusion™ technology.
The first in a broader roadmap of electronic design automation (EDA) solutions, Multiphysics Fusion technology brings together Synopsys’ industry-leading silicon design tools with the gold-standard signoff analysis capabilities from Ansys. These differentiated technologies will help engineering teams achieve better power, performance, and area (PPA) and faster time-to-results.
The first wave of EDA products to incorporate Multiphysics Fusion technology can be grouped into three main areas:
- Enhanced multiphysics design capabilities
- Higher-accuracy multiphysics signoff for manufacturing
- Expanded analog capabilities for high-speed design and 3DIC multi-die systems
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Multiphysics timing signoff
Leading-edge digital designs for high-performance computing (HPC) and artificial intelligence (AI) all make use of the latest, most advanced manufacturing processes to deliver the best performance. But advanced processes below 7 nm come with intense physical coupling interactions that make design significantly more complex. Dealing with these multiphysics effects is essential to meet performance targets and deliver chips on schedule.
In unveiling Multiphysics Fusion technology, we announced a series of integrated capabilities that bring voltage drop awareness and thermal analysis to timing signoff for extreme operating conditions and stringent reliability requirements.
Voltage drop (often referred to as “IR-drop”) is an inevitable consequence of high switching speeds with today’s ultra-low voltage processes. Voltage drop slows down transistor speeds in the affected areas, which can lead to performance degradation or even functional failure. Thermal heating is a closely related effect that has grown more intense as advanced chips now routinely consume hundreds of watts of electrical energy. Transistor performance is temperature-dependent, so thermal has naturally become a serious, first-order concern for leading design teams.
Our new capabilities enable more accurate and reliable timing signoff simulations, which eliminate wasteful and excessive safety margins for faster, cheaper designs. And the in-design data flow speeds up turnaround times by eliminating the need to exchange large data files.
Multiphysics-driven design closure
Voltage and temperature have significant impacts on chip timing. Our new Multiphysics Fusion technology incorporates thermal and voltage drop awareness into design closure for faster late-stage bug fixes, helping reduce design iterations and improve PPA.
Incremental voltage drop analysis provides immediate feedback for each iteration of the design closure process, which avoids any changes that would create new voltage drop violations. This shortens design times by enabling early detection and fast resolution of issues with excellent correlation to final signoff validation.
Analog design enablement
Once limited to radio frequency (RF) chip design, the need for electromagnetic (EM) analysis has expanded into many more product categories. This is due to ubiquitous wireless connectivity and high-speed digital communication, and it has become essential for multi-die designs like graphics processing units (GPUs) and AI chips. These designs feature devices or interconnect wires that are fully coupled through electrical and magnetic fields, requiring complex analysis that is much more analog and non-local than traditional digital analysis.
The Ansys acquisition includes some of the industry’s most trusted electromagnetic simulators as well as intelligent parasitic analysis tools for identifying root causes. Multiphysics Fusion technology introduces these analog capabilities for earlier analysis and higher-accuracy final signoff.
Multi-die design
Advanced multi-die assemblies (such as 2D, 2.5D, and 3DIC) are foundational technologies that make modern HPC and AI chips possible. However, they come with unique complexities and requirements that cannot be addressed with traditional EDA flows and tools. Addressing these complexities requires advanced multiphysics simulation to evaluate emerging engineering issues, such as structural integrity under thermo‑mechanical loading.
Multiphysics Fusion technology delivers thermal integrity, power integrity, and structural integrity optimization across the full EDA stack — from early floorplanning to signoff. It also introduces high-speed auto-routing with AI-driven signal integrity optimization for our Multi-Die Platform, making it a comprehensive solution for all aspects of multi-die prototyping, design, and signoff analysis.
Part of a broader roadmap
Based on the feedback of our leading customers, Multiphysics Fusion technology will address a number of urgent needs. By combining leading EDA tools with gold-standard multiphysics capabilities, these new solutions will enable engineering teams across industries to tackle unprecedented complexity and accelerate silicon-to-systems design.
We look forward to helping them unlock their potential and delivering more solutions that fuse design, simulation, and analysis.
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