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Innovate Faster with Synopsys Multi-Die Solution

Explore our eBook for scalable multi-die solutions to boost innovation, productivity, and success.

Automotive Executive Guide: Rethinking Automotive Development

A guide to virtualization in software-defined vehicles for automotive leaders.

Mastering AI Chip Complexity

This eBook explores AI chip design trends, challenges,
and strategies for first-pass silicon success.

From this Author

How Multi-Die Designs Boost Automotive Chip Innovation

BLOG Nov 04, 2025/3 min read

BLOG

How Multi-Die Designs Boost Automotive Chip Innovation

By Sajani Patel, Hezi Saar

Tags: Multi-Die, Silicon Lifecycle Management, Design, 3DIC Design, About Synopsys, Physical Implementation, Automotive, Silicon IP, Verification, Virtual Prototyping

First-Pass Silicon Success on TSMC’s N2 Process Will Enable New Generation of AI-Enabled Edge Devices

BLOG Apr 23, 2025/3 min read

BLOG

First-Pass Silicon Success on TSMC’s N2 Process Will Enable New Generation of AI-Enabled Edge Devices

By Hezi Saar

Tags: AI & Machine Learning, About Synopsys, 5G Wireless, Internet of Things, Interface IP, Foundation IP, Silicon IP

Innovating ADAS and IVI SoCs for Software-Defined Vehicles with Advanced Automotive IP

ARTICLE Jul 17, 2024/7 min read

ARTICLE

Innovating ADAS and IVI SoCs for Software-Defined Vehicles with Advanced Automotive IP

By Hezi Saar

Tags: Silicon IP Technical Bulletin, Interface IP, Silicon IP

How Synopsys IP and TSMC’s N12e Process are Driving AIoT

BLOG May 08, 2024/5 min read

BLOG

How Synopsys IP and TSMC’s N12e Process are Driving AIoT

By Hezi Saar

Tags: AI & Machine Learning, About Synopsys, Internet of Things, Interface IP, Silicon IP

Infineon Drives Automotive MCU Performance Higher with Synopsys Interface IP

BLOG Sep 14, 2023/3 min read

BLOG

Infineon Drives Automotive MCU Performance Higher with Synopsys Interface IP

By Ron DiGiuseppe, Hezi Saar

Tags: Customer Spotlight, About Synopsys, Automotive, Silicon IP

Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC’s N3E Process

BLOG Jul 19, 2023/6 min read

BLOG

Minimize Design Risk and Achieve First-Pass Silicon Success on TSMC’s N3E Process

By Josefina Hobbs, Hezi Saar

Tags: About Synopsys, Design Technology Co-Optimization, Silicon IP

How Security for SoC Interfaces Enhances Data Protection

BLOG Oct 04, 2022/8 min read

BLOG

How Security for SoC Interfaces Enhances Data Protection

By Michael Posner, Dana Neustadter, Hezi Saar

Tags: Data Center, Security IP, About Synopsys, Internet of Things, Interface IP, Automotive, Silicon IP

Implementing MIPI Camera and Display Interfaces Beyond Mobile Applications

ARTICLE Oct 24, 2016/6 min read

ARTICLE

Implementing MIPI Camera and Display Interfaces Beyond Mobile Applications

By Hezi Saar

Tags: Silicon IP Technical Bulletin, Interface IP, Automotive, Consumer, Silicon IP

Understanding the MIPI M-PHY

ARTICLE Apr 20, 2014/6 min read

ARTICLE

Understanding the MIPI M-PHY

By Sérgio Silva, Hezi Saar

Tags: Data Center, Silicon IP Technical Bulletin, Silicon IP

WB | IP Design Considerations for Real-Time Edge AI Systems

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WEBINAR

WB | IP Design Considerations for Real-Time Edge AI Systems

Featuring Hezi Saar

Hezi Saar

Hezi Saar is the Executive Director of Product Marketing at Synopsys, responsible for the Mobile, Automotive, and Consumer IP product lines. He brings more than 20 years of experience in the semiconductor and embedded systems industries. Hezi holds a Bachelor of Science degree in Computer Science and Economics from Tel Aviv University and an MBA from Columbia Southern University.

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