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Electrical, Thermal, and Structural Integrity Signoff Solution for Multi-Die Systems
Synopsys RedHawk-SC Electrothermal™ delivers multiphysics signoff for 2.5/3D multi-die designs, unifying power integrity, signal integrity, thermal integrity, and structural integrity in a single platform. Integrated with Synopsys 3DIC Compiler, it enables system technology co-optimization (STCO) and supports high-capacity simulation from early prototyping through final signoff for complex chip-package systems.
Key Benefits
Features
Advanced Thermal Modeling
Provides high-resolution thermal and mechanical analysis for complete multi-die designs, including interposer, package, and cooling structures. An adaptive finite element method (FEM) solver supports anisotropic material modeling and temperature-dependent power to accurately predict hotspot locations and overall thermal behavior. Static and transient analysis enables thermal management strategies such as throttling and workload-based scenarios. Coupled electrothermal simulation captures Joule heating, thermal cycling, and thermal-induced stress. Seamlessly work with RedHawk-SC, Totem-SC, and AEDT Icepak™ enables silicon-correlated boundary conditions and thermal-aware electromigration analysis across multiple design scales.
System Power Integrity Analysis
Parasitics extraction, model assembly and prototype model generation of complete 2.5D/3DIC power delivery networks for impedance profiling, transient voltage/current analysis at bumps, and early-stage system power integrity analysis. Automated SPICE deck generation and circuit simulation with internal and external simulators including Nspice and PrimeSim.
Signal Integrity Verification
Models high-speed chip-to-chip interfaces (e.g., UCIe, HBM) across TSVs, interposers, and packages using integrated electromagnetic solver in HFSS-IC™. Captures coupling between power noise and signal integrity (SIPI), supporting eye diagram analysis and JEDEC-compliant checks for high-speed channels. Also reports peak current and voltage at interfaces to enable system-level reliability evaluation.
Structural Stress and Warpage Analysis
Uses an integrated mechanical solver to evaluate stress and warpage caused by thermal expansion. Delivers insights into reliability risks, enabling optimization of package stack-up, materials, and design for manufacturability and long-term robustness.
Early Prototyping Capability
Enables rapid design exploration using reduced-order and lumped models for early power and thermal analysis. Supports fast feasibility assessment and early identification of system-level issues before full implementation. This approach reduces late-stage redesign and accelerates overall design convergence.
Powerful Hierarchical Modeling
Supports scalable system-level modeling across dies, interposer, and package using both reduced-order and detailed extracted models. Handles millions of interconnects, including micro bumps, TSVs, and hybrid bonding, while maintaining accuracy and capacity. Supports the 3Dblox standard for interoperability across 3DIC design flows and teams.
AI-driven Multiphysics Optimization
Work with Ansys optiSLang for AI-driven multiphysics optimization enabling efficient design space exploration and system-level optimization.
Technical Capabilities
RedHawk-SC Electrothermal provides detailed thermal, power, electrical, and structural integrity analysis for multi-die semiconductor assemblies. It leverages mature and proven best-in-class engines for finite-element meshing, power, signal integrity, and stress calculations, scalable to billions of instances. Integrated with board and system analysis tools, it supports early prototyping, hierarchical modeling formats, and seamless connections to Icepak for system-level thermal analysis.
FAQ
The platform is designed for 2.5D and 3DIC multi-die, heterogeneous integration systems, including chip, package, and interposer configurations across a range of advanced packaging technologies, including those from TSMC, Samsung, and Intel Foundry.
Multi-die systems are simply too large to simulate in full detail. RedHawk-SC Electrothermal offers a sophisticated hierarchical modeling methodology where each component of the system is captured with a Chip Thermal Model (CTM), or Chip Power Model (CPM), or Chip Signal Model (CSM). These reduced-order-models (ROMs) enable efficient full-system simulation, and facilitate component information interchange between engines.
Yes, it is certified by major foundries for thermal analysis of advanced multi-die packaging technologies, ensuring trusted signoff and industry compliance.
Yes. The solution offers early prototyping capabilities using block-level power and thermal estimates, helping engineers optimize designs prior to final implementation.
RedHawk-SC Electrothermal integrates seamlessly with Synopsys RedHawk-SC and Totem for power analysis, HFSS-IC for electromagnetic signal integrity, Ansys AEDT Icepak and for thermal boundary conditions, SIwave for board-level power models, and Ansys optiSLang for system parameter optimization.