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Electrical, Thermal, and Structural Integrity Signoff Solution for Multi-Die Systems
Synopsys RedHawk-SC Electrothermal delivers multiphysics signoff for multi-die (2.5/3DIC) systems, integrating power integrity, signal integrity, thermal integrity, and structural integrity in a unified platform. Integrated with Synopsys 3DIC Compiler implementation, it is designed for high-capacity simulation, prototype exploration, and signoff of multi-die chip assemblies and interposers, reducing design time and risk for engineers tackling advanced IC packaging challenges.
Key Benefits
Features
Advanced Thermal Modeling
Includes a proven thermal solver to deliver precise static and transient thermal analysis for complete multi-die assemblies, including interposer, package, and heat sinks. Synopsys RedHawk-SC and Totem provide accurate power source information while Icepak generates system-level boundary conditions (HTC). This integration supports accurate max temperature, time-domain transients, identification of hot spots, and evaluation of cooling strategies, empowering teams to mitigate overheating risks and optimize thermo-mechanical reliability early in the design flow.
Full-System EM/IR Power Integrity Analysis
Analyzes the entire 2.5D/3DIC power distribution network for IR-drop, current density, and thermal-aware electromigration. Power integrity analysis includes deep-trench decaps on the interposer and can also include package and board-level power network models. Reports peak current and voltage for each pad which enables engineers to assess reliability risks at both chip and package levels, ensuring robust power delivery across large integrated systems.
Signal Integrity Verification
Extracts coupled electromagnetic models for chip-to-chip signal channels like UCIe and HBM channels throughout the full 3D stack, through-silicon vias (TSVs), interposer, and package. The solution enables in-depth SI analysis to detect crosstalk, reflection, and timing issues, helping designers resolve potential communication bottlenecks and maintain high-speed signal integrity in complex packaging environments.
Structural Stress and Warpage Analysis
Supports an integrated mechanical solver engine to calculate Von Mises stresses and displacements resulting from thermal expansion and outside forces. Provides actionable insights into package deformation and reliability, allowing engineers to predict structural failures and optimize stack-up and material choices for robust, manufacturable designs.
Early Prototyping Capability
Enables rapid iteration by providing early feedback on power and thermal integrity using block-level power estimates and preliminary layout models. Interactive multi-die visualization accelerates design exploration, helping teams identify and resolve potential issues before committing to full implementation, reducing costly late-stage surprises.
Powerful Hierarchical Modeling
Facilitates hierarchical analysis using reduced order models (ROMs) for individual chips, interposer, and package. These ROMs capture accurate power, thermal, SI, and ESD characteristics created by signoff analysis tools like RedHawk-SC, Totem, and HFSS-IC, or quick prototypes created by the user. Supports compact model exchange between teams and tools, simplifying integration of complex elements and complete system views, and enabling scalable analysis of multi-level assemblies for accurate signoff.
AI-driven Multiphysics Optimization
Integrates with Ansys optiSLang for AI-driven multiphysics system optimization and Ansys Sherlock for lifetime reliability analysis.
Technical Capabilities
RedHawk-SC Electrothermal provides detailed thermal, power, electrical, and structural integrity analysis for multi-die semiconductor assemblies. It leverages mature and proven best-in-class engines for finite-element meshing, power, signal integrity, and stress calculations, scalable to billions of instances. Integrated with board and system analysis tools, it supports early prototyping, hierarchical modeling formats, and seamless connections to Icepak for system-level thermal analysis.
FAQ
The platform is designed for 2.5D and 3DIC multi-die, heterogeneous integration systems, including chip, package, and interposer configurations across a range of advanced packaging technologies, including those from TSMC, Samsung, and Intel Foundry.
Multi-die systems are simply too large to simulate in full detail. RedHawk-SC Electrothermal offers a sophisticated hierarchical modeling methodology where each component of the system is captured with a Chip Thermal Model (CTM), or Chip Power Model (CPM), or Chip Signal Model (CSM). These reduced-order-models (ROMs) enable efficient full-system simulation, and facilitate component information interchange between engines.
Yes, it is certified by major foundries for thermal analysis of advanced multi-die packaging technologies, ensuring trusted signoff and industry compliance.
Yes. The solution offers early prototyping capabilities using block-level power and thermal estimates, helping engineers optimize designs prior to final implementation.
RedHawk-SC Electrothermal integrates seamlessly with Synopsys RedHawk-SC and Totem for power analysis, HFSS-IC for electromagnetic signal integrity, Ansys AEDT Icepak and for thermal boundary conditions, SIwave for board-level power models, and Ansys optiSLang for system parameter optimization.