Semiconductors have always been challenging to develop, with many waves of innovation in electronic design automation (EDA) tools and fabrication technologies barely keeping ahead of ever-growing design size and sophistication. Once again, the industry has reached a tipping point. The combination of increasing chip and system complexity, coupled with higher expectations for product performance and longevity, has defined new boundary limitations in designing, manufacturing and deploying semiconductors. Incremental improvements to traditional methods will not be enough to move forward; a new approach is required.
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