Synopsys and Ansys power the future of innovation—connecting silicon to systems.
EDA
System
IP
SolvNetPlus
Training & Education
Transforming Ideas into Silicon
Samsung Foundry and Synopsys are accelerating next-generation semiconductor innovation through deep ecosystem collaboration.
By combining Samsung Foundry’s advanced process technologies, world-class manufacturing, and advanced packaging with Synopsys’ AI-powered EDA tools, certified design flows, and silicon-validated IP, we provide an integrated, end-to-end platform from design to silicon.
Together, we empower customers to reduce design complexity, accelerate time-to-market, and turn innovative ideas into differentiated silicon for AI, HPC, automotive, mobile, and IoT applications.
What's New
Interview with Sassine Ghazi, President and CEO of Synopsys, at Samsung SAFE 2026
Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026
Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes
Customer Testimonial: Advancing AI from Silicon to Systems with Samsung
Key Benefits
Areas of Collaboration
Leading-Edge Node Enablement
• Optimized PPAC Realization: Achieving best-in-class power, performance, area, and cost through tight collaboration on DTCO and PDK enablement.
• Next-Gen AI Design Flows: Deploying AI and agentic AI across digital, analog, and multiphysics flows to support Samsung Foundry’s roadmap through the 1.4nm node.
• Accelerated IP Migration: Cutting design time and boosting IP reuse via optimized digital/analog node migration across process nodes.
Certified IP for Physical AI, HPC, Automotive & Beyond
• Comprehensive IP Portfolio: Access a complete portfolio of silicon-proven Synopsys IP optimized for PPA and latency across Samsung Foundry’s process technologies from 28nm to 2nm.
• Industry-Leading connectivity: Leverage the latest industry standards and specialized IP solutions, including high-speed interfaces: DDR, LPDDR, HBM, 224/112G, PCIe/CXL, UCIe, and MIPI
• Automotive-Grade Reliability: Deploy specialized, automotive-qualified IP tailored for Samsung Foundry’s 5nm, 4nm, and 2nm automotive-specific processes
System-level Solutions: Multi-Die & Chiplet Solutions
• Accelerated System Deployment: Achieve faster time-to-market, enhanced system performance, and superior reliability for complex chiplet-based systems
• End-to-End Architecture Expertise: Comprehensive support spanning from traditional single-chip designs to full-system, heterogeneous, and vertically integrated chiplet-based architectures
• Continuous Co-Optimization: Driving ongoing refinement in DTCO and STCO to reduce routing design time while maximizing overall system performance and reliability
• Solving Critical Design Hurdles: Your partners for solving critical design hurdles including complex floor-planning , inter-die routing, precise TSV (Through-Silicon Via) placement and advanced thermal management
