3DIC Solution

Push the limits of multi-die design with the most integrated and extensive tools, IP and methodologies

Think Big. Explore Fast. Converge Reliably.

Multi-die design offers a momentous opportunity to greatly elevate product value by significantly enhancing achievable differentiation. However, the scale and scope of the multi-die design challenge demands new thinking beyond point-tools, and toward validated, unified, and holistic solutions that are fit for purpose. Synopsys’ most comprehensive, scalable and trusted 3DIC solution is the fastest path to successful multi-die design, giving designers the biggest opportunity to efficiently define and deliver industry’s most innovative products that are shaping the market today.


Key Benefits

Most Scalable
Free your imagination with a design environment built from the ground up to meet the challenges of the industry's most demanding systems and applications
Most Comprehensive
Cover all bases with a converged, end-to-end solution spanning silicon engineering, IP, design, analysis, verification, test, and silicon lifecycle management
Most Trusted
Minimize risk and accelerate path to optimal system with silicon-proven IP, production-hardened design engines, as well as golden signoff and verification technologies

The Industry's Most Expansive 3DIC Solution

System-level design in the SysMoore era requires an integrated, scalable co-design solution to address increasing complexity and productivity challenges. The Synopsys 3DIC solution provides the most comprehensive, end-to-end solution, from design to lifecycle management, for heterogeneous integration of chips.

The Synopsys 3DIC solution is comprised of silicon-proven, best-in-class EDA and IP. Planning, design, test, and verification technologies come together around a common, uniquely integrated design platform: Synopsys 3DIC Compiler. A unified 3DIC integration and optimization platform, 3DIC Compiler is built on Synopsys’ Fusion data model and integrated with some of the industry’s most-trusted, golden-signoff solutions. The Synopsys 3DIC solution is strengthened by Synopsys’ silicon-proven DesignWare® Die-to-Die IP for low latency, which lowers integration risks and accelerates standards adoption.

Explore Our Solution

3DIC Compiler | Synopsys

The Industry's 1st Unified Platform to Accelerate Multi-die System Design and Integration

The Synopsys 3DIC Compiler platform is a complete, end-to-end solution for efficient, 2.5D, and 3D multi-die system integration. Built on the common, single-data-model infrastructure of the Synopsys Fusion Design Platform™, 3DIC Compiler coalesces numerous transformative, multi-die design capabilities to offer a complete architecture-to-signoff platform – all in a unique, consolidated user environment. This hyper-converged solution comprises immersive 2D and 3D visualization, cross-hierarchy exploration and planning, design and implementation, DFx, and system-level validation and signoff analysis. Take advantage of the highest levels of design efficiency with the ability to scale in capacity and performance to seamlessly support dozens of stacked, heterogeneous-process dies, comprising billions of inter-die connections.

Die-to-Die Controller | Synopsys

DesignWare IP

Designers are splitting SoCs into multiple dies to improve yield, PPA, and scalability for various use cases such as die splitting, die disaggregation, compute scaling and aggregation of functions. To meet the extensive die and SDRAM connectivity requirements for such multi-die SoCs, designers are using Synopsys’ silicon-proven DesignWare Die-to-Die and HBM IP solutions. The solutions offer low-latency controllers and power-efficient PHYs available on the most advanced FinFET processes, supporting 2.5D or 3D packaging technologies. The die-to-die IP enables reliable 112G XSR and parallel-based HBI links, and the HBM IP allows up to 921 GB/s HBM3 SDRAMs.

Actionable Insights Through In-Silicon Monitoring and Analytics

Semiconductor design, manufacturing and system deployment are being challenged on many fronts due to process variability, device aging effects, ever increasing performance expectations, and the continued reduction in time to volume. 3DIC packaging evolution has also had a significant impact on a design’s lifecycle.

Synopsys is leading the industry to solve these challenges with the SiliconMAX Silicon Lifecycle (SLM) platform, a comprehensive set of integrated design tools, IP, analytics and methodologies. SiliconMAX intelligently and efficiently collects and stores monitor data throughout the life of the SoC and provides actionable insights through the use of powerful analysis engines.

Test + -

Enabling Efficient Test for 3DIC

Emerging 3DIC and chiplet based designs limit test data bandwidth thereby reducing the effectiveness of traditional manufacturing test. Multi-die and HBM stack integration in 3D devices with new high-speed, high-bandwidth interfaces, and die-access mechanisms further increase test challenges and requirements.

Synopsys TestMAX™ platform provides a 3DIC test solution with advanced test data delivery and hierarchical flow. The platform is based on a unified environment that supports RTL DFT integration and synthesis-driven implementation for accelerated architectural exploration, early verification and optimal power, performance, and area (PPA).

Become a Synopsys 3DIC Expert

Video

Exploring Synopsys' 3DIC Solution

Chairman and co-CEO Aart de Geus highlights the scalability, optimality, and verifiability of Synopsys’ 3DIC Solution in this excerpt from the 2022 ISSCC keynote.

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