Any Tool. Any Scale. Any Time.
Ansys RedHawk-SC Electrothermal solves the electrical and thermal coupling interactions of 2.5D/3DIC structures in full detail for up to a billion instances, concurrently. Synopsys’ 3DIC Compiler platform provides a complete, end-to-end heterogeneous solution for efficient 2.5/3D multi-die design and full- system integration. The result is a robust, integrated design development that accelerates 3D system-level convergence and optimizes power, performance and area (PPA/mm3) for heterogeneous design and 3D integration. Customers can address their 3D multi-die, multi-node implementation with greater confidence and bring products to market more quickly.