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TSMC 2019 Open Innovation Platform (OIP)
TSMC Recognizes Synopsys with Four Partner Awards at the OIP Forum
Synopsys Recognized for Collaboration on Interface IP, Joint Development of 6-nm Design Infrastructure, Joint Delivery of SoIC 3D Chip Stacking Solution, and Joint Delivery of Cloud-based Productivity Solution.
News Release
News Release
Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
Learn More
News Release
Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
Learn More
News Release
Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs
Learn More