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TSMC 2019 Open Innovation Platform (OIP)

TSMC Recognizes Synopsys with Four Partner Awards at the OIP Forum

Synopsys Recognized for Collaboration on Interface IP, Joint Development of 6-nm Design Infrastructure, Joint Delivery of SoIC 3D Chip Stacking Solution, and Joint Delivery of Cloud-based Productivity Solution.

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With its extensive high-quality DesignWare IP portfolio, certified design platforms, and cloud solution, Synopsys and TSMC are addressing our customers' needs to achieve their design goals and accelerate production."

Suk Lee

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Sr. Director, Design Infrastructure Management Division, TSMC

Press Release

TSMC Recognizes Synopsys with Four Partner Awards

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Press Release

Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements

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Press Release

Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process

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Press Release

Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs

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