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TSMC 2019 Open Innovation Platform (OIP)
TSMC Recognizes Synopsys with Four Partner Awards at the OIP Forum
Synopsys Recognized for Collaboration on Interface IP, Joint Development of 6-nm Design Infrastructure, Joint Delivery of SoIC 3D Chip Stacking Solution, and Joint Delivery of Cloud-based Productivity Solution.
Press Release
Press Release
Synopsys and TSMC Collaborate for Certification on 5nm Process Technologies to Address Next-generation HPC, Mobile Design Requirements
Learn More
Press Release
Synopsys and TSMC Collaborate to Develop Portfolio of DesignWare IP for TSMC 5nm FinFET Plus (N5P) Process
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Press Release
Synopsys Extends Portfolio of Cloud Computing IP with 112G Ethernet PHY for Hyperscale Data Center SoCs
Learn More