Reliability is defined by defective parts per million (DPPM) under a set of temperature conditions over time as specified in the mission profile. Whether it is an IC, a system, or individual IP components, DPPM must meet reliability specifications under a wide range of temperatures. For ADAS applications, Grade 2, Grade 1, and Grade 0 temperature ratings are commonly used. Grade 0, the most stringent, is reserved for under the hood and drivetrain applications where a junction temperature can go as high as 175C. Grade 2 is the base level for automotive applications, with reliability requirements similar to those found in consumer electronics. Functionality should be validated up to 125°C junction temperatures. Grade 1 ratings require that functionality is be validated up to 150°C junction temperatures, with reliability of <1 DPPM. Electromigration (EM) profiles can be application specific for ADAS implementations and memories must integrate error-correction checking (ECC).
Foundation IP for ADAS controllers must include EDA views for timing and power so that SoC designers can validate the reliable performance of their SoC over the life of the product per the mission profile. Aging corners simulate the state of the silicon at the end of its useful life as specified in the mission profile. They enable designers to measure how the silicon slows down over time (while leakage improves) and to assure functionality at end of life. EM corners enable power analysis to verify that circuits will not fail EM limits given the operational activity of the circuits with the loads placed on each output. Physical EDA implementation tools can provide solutions to those violations before tapeout by decreasing fanout or using higher drive cells. Finally, burn-in corners can be used to simulate the behavior of the device when going through accelerated life testing. This testing uses extreme oven temperatures with overdriven voltages design to prove out end of life models during high temperature operating life (HTOL) tests.