For some high-performance computing (HPC) designs, monolithic SoCs aren’t producing the scalability and yield that designers are looking for. New trends towards 3DIC design are emerging introducing new design challenges, such as reliable die-to-die connectivity, high bandwidth memory, integration, and 2.5D or 3D packaging options. This webinar will outline the different market trends for 3DIC designs and explain how designers can maintain such new trends to deliver their designs with optimized latency, power, performance, and area. We will also demonstrate the construction of a 3DIC design and our 3rd generation HBM interposer auto-routing solution.
Attend this Synopsys webinar to:
- Learn about considerations and trends for a more efficient 3DIC design integration
- Find out how protocols like HBM3 and Die-to-Die are influencing 3DIC designs
- See a demo of a 3DIC design construction