Watch the Synopsys Presentations On-Demand:

 

New Dimensions, New Opportunities: Sparking a New Age of Innovation with Multi-Die Design

Multi-die architectures are emerging as a catalyst, sparking continued innovation and opening up new opportunities in broad market applications, including AI, high-performance computing, and mobile. This presentation will discuss the “coming of age” of multi-die design and highlight Synopsys’ software-to-silicon system-level solution that is enabling the next wave of transformative products.

Shekhar Kapoor, Sr. Director, Product Marketing, Synopsys

 

 

A Vision for Software-Driven Energy Efficient Design

Synopsys presents industry trends for energy efficient design, along with its vision and solutions for a ‘shift-left’ methodology. Topics include architectural tradeoffs, power profiling with real software workloads, RTL design for low power, RTL power regressions, power-driven implementation, and power signoff.

Solaiman Rahim, Group Director, R&D, Synopsys

 

 

Reliable and Secure Silicon Throughout the Lifecycle

The future of silicon health management is hardware analytics and test. In this session you will learn how Synopsys verification, signoff and silicon lifecycle management (SLM) solutions are enabling secure, reliable, and resilient silicon.

Adam Cron, Distinguished Architect, Synopsys

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