HOME   IP   INTERFACE AND STANDARDS IP   USB   DESIGNWARE USB 3.0 FEMTOPHY IP  
Language: 日本語 | 简中

DesignWare USB 3.0 femtoPHY IP

Search Tools

Spotlight

The Synopsys DesignWare® USB 3.0 femtoPHY provides designers with a complete physical (PHY) layer IP solution for low-power mobile and consumer applications such as digital cameras, networking and storage as well as next–generation feature-rich smartphones, tablets, digital TVs and media players requiring high throughput USB capability. Offering reduced silicon cost and longer battery life, the DesignWare USB 3.0 femtoPHY IP delivers 50% smaller die area and minimizes active and suspend power consumption.

The DesignWare USB 3.0 femtoPHY implements the latest USB Battery Charging and USB On-The-Go (OTG) specifications from the USB Implementer’s Forum (USB-IF).

Architected for the industry’s most advanced 1.8V process technologies, the USB 3.0 femtoPHY is designed with features created to minimize effects due to variations in foundry process, device models, packages, and board parasitics.

The DesignWare USB 3.0 femtoPHY builds on years of customer success with Synopsys’ silicon-proven USB PHY IP product line, which has been ported to over 100 process nodes and configuration combinations ranging from 180-nm to 14/16-nm FinFET. When combined with the DesignWare digital controllers and verification IP, the DesignWare USB 3.0 femtoPHY delivers a complete low power and small die area solution for advanced system-on-chip (SoC) designs.

DesignWare SuperSpeed USB 3.0 Complete Solution
DesignWare USB 3.0 femtoPHY IP
 



New DesignWare® USB 2.0 & 3.0 femtoPHY IP: FinFET Silicon Success
View the silicon test results of the new DesignWare USB femtoPHY family. DesignWare USB 2.0 and 3.0 femtoPHYs, available now on leading FinFET process technologies, reduce USB area by 50% compared to previous generations.

Gervais Fong
Sr. USB Product Marketing Manager

  • Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes
  • Supports SuperSpeed 5 Gbps data rate and is backward compatible with all USB 2.0 data rates including 480 Mbps (High-Speed), 12 Mbps (Full-Speed) and 1.5 Mbps (Low-Speed)
  • Integrates high-speed, mixed-signal custom CMOS circuitry designed to PIPE3 and UTMI+ Level 3 specifications
  • Can be used in USB Device, Host, or On-The-Go applications
  • Designed for easy integration with DesignWare USB 3.0 Controllers
  • USB-IF Certified
USB 3.0 femtoPHY - TSMC 16FF+LL x1 OTG, North/South Poly OrientationSTARsSubscribe
USB 3.0 femtoPHY-TSMC 28HPC18 x1 OTG, North/South Poly OrientationSTARsSubscribe

  Description USB 3.0 femtoPHY - TSMC 16FF+LL x1 OTG, North/South Poly Orientation
  Name dwc_usb3_femtophy_otg_tsmc16ffpll_x1ns
  Version 4.1a
  STARs Open and/or Closed STARs
  myDesignWare Subscribe for Notifications
  Product Type DesignWare Cores
  Documentation
  Download dwc_usb3_femtophy_otg_tsmc16ffpll_x1ns
  Product Code A365-0
  
  Description USB 3.0 femtoPHY-TSMC 28HPC18 x1 OTG, North/South Poly Orientation
  Name dwc_usb3_femtophy_otg_tsmc28hpc_x1ns
  Version 4.2a
  STARs Open and/or Closed STARs
  myDesignWare Subscribe for Notifications
  Product Type DesignWare Cores
  Documentation
  Download USB3-femtoPHY_TSMC_28HPC18
  Product Code A705-0