Analog mixed-signal (AMS) semiconductors face challenges from rising signal frequencies, increasing design sizes, and the demands of advanced silicon manufacturing processes. These factors introduce complex nonlinear multiphysics effects in interconnect wires, which design teams often struggle to model accurately. The impact of interconnects on circuit performance is so significant that precise modeling of electromagnetic, RF, thermal, optical, parasitic, voltage drop, reliability, power, and other multiphysics interactions have become essential for successful designs.
Interconnect models must be re-extracted for every layout iteration, incorporating all relevant physics—including package/system interactions—even for large-scale designs like multi-die (3D-IC) systems and memories.
The Synopsys AMS product suite provides a mature and strategic solution to the multiphysics interconnect challenge and is certified by all major foundries.
Debugging AMS designs is often manual, inefficient, and time-consuming, significantly increasing design costs. Synopsys accelerates design convergence with advanced root-cause parasitic analysis, enabling teams to quickly identify fixes, meet deadlines, optimize chip performance, and ensure product reliability.
The growing application of wireless connectivity in many products and the increasing speed of integrated circuits have raised the importance of analog and mixed signal (AMS) circuits. These pose distinct challenges from those for digital design, and AMS design engineers must master a broad set of physical phenomena with unique market requirements.
The growing application of wireless connectivity in many products and the increasing speed of integrated circuits have raised the importance of analog and mixed signal (AMS) circuits. These pose distinct challenges from those for digital design, and AMS design engineers must master a broad set of physical phenomena with unique market requirements.