Die to Die IP 解决方案

<p>Synopsys’ complete Die-to-Die IP solution includes 112G XSR and UCIe controllers and PHYs, with leading power, latency and die edge efficiency, for high-performance computing SoCs. The solution also includes HBI/AIB PHY. Synopsys UCIe IP, supporting standard and advanced packaging technologies, delivers up to 4Tbps bandwidth in a multi-module configuration. The UCIe controller enables an ultra-low latency link between two dies based on popular protocols and for compute-to-compute and compute-to-IO connectivity.&nbsp;Synopsys 112G XSR IP leverages high-speed SerDes technology up to 112G per lane for ultra and extra short reach links. The XSR controller includes a highly optimized FEC for a reliable, low latency link between two dies.&nbsp;Synopsys HBI/AIB PHY, supporting the AIB 2.0 standard, leverages wide-parallel bus technology and delivers 4Gbps per pin die-to-die connectivity with low latency.</p>

Overview

新思科技(Synopsys)推出了一款全面的Multi-Die设计解决方案,涵盖UCIe和112G XSR控制器、物理层(PHY)及验证IP。该UCIe PHY已获多家行业领先企业采用,并在多种工艺上取得流片成功。该IP以40Gbps的速率运行,实现了最大的die-edge和功率效率、低延迟,并支持标准和先进的封装技术,同时符合最新的UCIe规范。UCIe控制器基于通用协议,实现芯片间的超低延迟连接,确保优异的互操作性。此外,新思科技的112G XSR IP采用高速SerDes技术,适用于极短距离(XSR)连接。XSR控制器配备高度优化的前向纠错(FEC)技术,确保芯片间连接的可靠性和低延迟。