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AI驱动的设计应用

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探索芯片设计、验证和制造解决方案

先进的芯片为我们每天依赖的卓越软件提供强力支持。从智能手机、可佩戴设备、智能医疗设备，到无人驾驶汽车，芯片是一切的基础。

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从基于标准的 IP 核到完整的定制架构，新思科技拥有值得信赖的 IP 核和子系统专家，能够满足您独特的芯片需求。

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每个业务都是软件业务。无论您是直接向客户销售软件，还是依靠软件运营您的业务，Synopsys 都能够以您业务所需的速度，帮助您通过建立对您软件的信任来保护您的最终盈利。

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资源

From this Author

Jun 21, 2023/1 min read

AI设计芯片的未来在何方，我们和专家聊了聊

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Jun 20, 2023/1 min read

四“轮”驱动，从“芯”打造更强智能汽车

By Wenjun Ni

Tags: Chip Design Insights, Automotive

Jun 16, 2023/1 min read

晶体管的第一个76年：变小了，却变大了？

By Wenjun Ni

Tags: Multi-Die System, Chip Design Insights, Design, Verification

Jun 15, 2023/1 min read

AIGC产业爆发，离800G以太网时代只差最后一步？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Silicon IP

Jun 14, 2023/1 min read

飞驰中的一亿行代码：智能汽车如何安全上路？

By Wenjun Ni

Tags: Chip Design Insights, Automotive

Jun 13, 2023/1 min read

如何加快数十亿门级低功耗SoC验证？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Verification

Jun 12, 2023/1 min read

Multi-Die如何引领后摩尔时代的创新？

By Wenjun Ni

Tags: Multi-Die System, Chip Design Insights

Jun 07, 2023/1 min read

AI如何颠覆传统芯片验证方式？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Verification

May 30, 2023/1 min read

《麻省理工科技评论》：38%的半导体公司将采用Multi-Die系统

By Wenjun Ni

Tags: Multi-Die System, Chip Design Insights

May 24, 2023/1 min read

Multi-Die系统设计里程碑：UCIe PHY IP在台积公司N3E工艺上成功流片

By Wenjun Ni

Tags: Multi-Die System, Chip Design Insights, Design, Silicon IP, Verification

May 23, 2023/1 min read

AI走入应用场景：底层算力如何建构？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights

May 19, 2023/1 min read

CPU、DSP、GPU，首批AI设计的芯片用在了哪里？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

May 17, 2023/1 min read

测量材料表面，就可以提升光学设计精确度？

By Wenjun Ni

Tags: Optical

May 15, 2023/1 min read

通过合规性测试，实现PCIe生态系统协作的第一步

By Wenjun Ni

Tags: Chip Design Insights, Silicon IP

May 12, 2023/1 min read

为何AI需要新的芯片架构？

By Wenjun Ni

Tags: Multi-Die System, AI & Machine Learning, Chip Design Insights, Design, Verification

May 09, 2023/1 min read

AI+EDA，提升芯片验证覆盖率的利器

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Verification

May 08, 2023/1 min read

存储器接口，数据安全的关口

By Wenjun Ni

Tags: Silicon IP

Apr 25, 2023/1 min read

新能源汽车竞赛中，车规级芯片如何提速？

By Wenjun Ni

Tags: Chip Design Insights, Design, Automotive, Silicon IP, Verification

Apr 24, 2023/1 min read

AI会改变EDA的基因吗？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Apr 21, 2023/1 min read

从小众走向普及，形式化验证对系统级芯片开发有多重要？

By Wenjun Ni

Tags: Chip Design Insights, Design, Verification

Apr 18, 2023/1 min read

EDA+AI=Synopsys.ai：生产力Up Up Up

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Apr 17, 2023/1 min read

TBDAI如何助力“最后一公里”的设计优化？

By Wenjun Ni

Tags: Chip Design Insights

Apr 12, 2023/1 min read

如何设计开发下一代电池？

By Wenjun Ni

Tags: Chip Design Insights, Design, Verification

Apr 10, 2023/1 min read

RTLA+Verdi：打造开发者全新超能力，提前“看到”PPA表现

By Wenjun Ni

Tags: Chip Design Insights, Design, Verification

Apr 03, 2023/1 min read

新一代Linting技术：避免功能错误，更快完成芯片设计

By Wenjun Ni

Tags: Chip Design Insights, Design, Verification

Mar 28, 2023/1 min read

业界首个64 GT/s连接：PCIe 6.0新突破让数据传输再提速

By Wenjun Ni

Tags: Chip Design Insights, Silicon IP

Mar 27, 2023/1 min read

芯片革命：Multi-Die系统引领电子设计进阶之路

By Wenjun Ni

Tags: Multi-Die System, Chip Design Insights, Silicon IP

Mar 23, 2023/1 min read

新思科技携手英伟达，加速计算光刻进入“iPhone时刻”

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Mar 21, 2023/1 min read

新一轮AI竞赛中，为什么HPC一定是赢家？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, HPC, Data Center

Mar 20, 2023/1 min read

AR光学技术，打开虚拟与现实的任意门

By Wenjun Ni

Tags: Chip Design Insights, Optical

Mar 17, 2023/1 min read

ChatGPT的核心算法为何如此强大？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights

Mar 13, 2023/1 min read

谁在提前布局光子赛道？

By Wenjun Ni

Tags: Chip Design Insights, Photonic

Mar 09, 2023/1 min read

芯片行业为什么要持续投资AI？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Mar 07, 2023/1 min read

AI和ML携手优化仿真性能，从此解放开发者双手

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Mar 06, 2023/1 min read

数据中心黄金CP，让数据传输速度拉满

By Wenjun Ni

Tags: Chip Design Insights, HPC, Data Center

Mar 01, 2023/1 min read

芯片设计如何突破人类极限？

By Wenjun Ni

Tags: AI & Machine Learning, Chip Design Insights, Design, Verification

Jan 24, 2023/1 min read

嵌入式MRAM：满足先进节点SoC功耗需求的下一代内存技术

By Wenjun Ni

Tags: Silicon IP