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Driving the Next Wave of Semiconductor Innovation
As a trusted partner, Synopsys is driving the industry transformation to multi-die designs with a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA and IP products, enables early architecture exploration, rapid software development and system validation, efficient multi-die/advanced package co-design and optimization with multiphysics analysis, robust die-to-die and chip-to-chip connectivity, and improved manufacturing and reliability.
What's New
Discover the latest resources for multi-die design success
Key Benefits
Early Architecture Exploration
To realize best system performance for the target workloads, designers must efficiently explore the appropriate partitions and system-level interconnect fabric. Reusing IP effectively to meet time-to-market and ensuring testability are among some of the challenges that require fast and early analysis-driven exploration. With early architecture exploration and analysis, system designers can optimize partitioning for the best performance, minimize interconnect traffic, and perform efficient power and thermal planning.
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Software Development, Verification and Validation
Software teams can quickly develop, integrate, and test the software by having access to proven virtual die models. Assembling virtual models in a virtual platform allows for early multi-die software bring-up, debug, and analysis. As dies become available they can be executed on hardware-assisted verification platforms that are enabled with large capacity and modularity features to efficiently handle the complexity of multi-die designs within the required turnaround time. Software can run large amounts of software and AI workloads in lockstep with the hardware using a unified, hybrid emulation and prototype environment, and assess power and performance metrices for the target application.
Design Implementation
For seamless 2.5D and 3D heterogeneous integration, designers need a unified multi-die/advanced package co-design platform with multiphysics analysis capabilities. This platform supports feasibility exploration, partitioning, prototyping, and floorplanning, and enables automation for 3D construction and advanced packaging including analysis-driven routing for high-speed interfaces. Designers can optimize for power and signal integrity, thermal and mechanical stress, as well as signoff verification.
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Silicon IP
Die-to-die connectivity IP, allows high-bandwidth, low power, and robust links between heterogeneous and homogeneous dies in a single 2.5D or 3D multi-die design. 3D-enabled interface IP can help minimize power and latency of chip-to-chip connectivity supporting various die topologies in a 3D stacked design. High-quality, complete controller, PHY, and verification IP solutions that are silicon proven, have achieved interoperability with ecosystem products, and are compliant with the most widely used standards, can minimize integration risk and accelerate time to market. IP integrated in configurable, pre-verified IP subsystems deliver complete, complex functions that are ready to integrate into SoCs or chiplets.
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Manufacturing & Reliability
Designers can help improve long-term health and reliability by testing, diagnosing, repairing, and improving operational metrics at every phase of the multi-die lifecycle. In addition, access to traceability and analytics across the dies for in-design, in-ramp, in-production and in-field optimization can help designers improve cost, quality, and reliability. Ensuring that top-quality, high-performance dies are properly binned during package assembly is critical.
Ecosystem Partners
Learn about our collaboration with our ecosystem partners in multi-die designs
Featured Resources
Looking for more resources to help with your multi-die designs? Explore our resources.
Resource Library
Explore videos, whitepapers, podcasts, and webinars to enhance your understanding and utilization of multi-die designs.
Explore Our Insights
Stay updated with Synopsys blogs featuring the newest trends and innovations in multi-die designs.
Frequently Asked Questions
Multi-die technology integrates multiple heterogeneous dies (or chiplets) into a single package. Each die typically performs a specific function, and they are interconnected via standards such as Universal Chiplet Interconnect Express (UCIe) to form a cohesive system. Multi-die technology offers flexibility, scalability, and cost-effectiveness compared to traditional monolithic chip designs.
In traditional monolithic chip design, all components are fabricated on a single piece of semiconductor material. In contrast, multi-die technology assembles multiple heterogeneous dies, fabricated on different foundry processes, into a single package. This allows for greater customization, mix-and-match of technologies, and improved yield management.
Multi-die technology accelerates scaling of system functionality, reduces risk and time-to-market by re-using proven dies, lowers system power while increasing throughput, and offers new product variants for flexible portfolio management.
Synopsys offers a comprehensive and scalable solution for fast heterogeneous integration. The solution, including EDA tools and IP, enables early architecture exploration, rapid software development and system validation, efficient die/package co-design, robust and secure die-to-die connectivity, and improved manufacturing and reliability.
Synopsys offers a range of products within its multi-die solution. These products help SoC and system architects and designers overcome challenges of multi-die design in the areas of architecture exploration, die/package co-design, multi-physics analysis, software development and validation, verification, die-to-die IP, test and repair, system signoff, and silicon lifecycle management.
Yes, Synopsys multi-die solution supports interoperability with common design formats, interfaces, and standards, some of which include 3Dblox and UCIe.
Synopsys offers comprehensive technical support, training programs, documentation, and community forums to assist users in adopting and mastering multi-die design methodologies using its solution. This includes access to expert application engineers, online resources, and user forums for sharing best practices and troubleshooting common issues.