Minimizing Design Risk: Rapid Feasibility Exploration for Multi-Die Designs

Multi-die design is revolutionizing semiconductor innovation, offering unprecedented flexibility, but also introducing complexity. What if designers could spot and solve critical issues, such as IR drop, electromigration, and thermal impact before they ever reach the design implementation stage? 

In this white paper, we explore how rapid, comprehensive feasibility exploration enables designers to confidently evaluate IR drop, electromigration, and thermal impacts early in the design process, minimizing costly late-stage surprises.

Learn how the feasibility flow delivers:

• Fast, lightweight analysis engines optimized for quick iterations in early exploration, not signoff
• Simple models for power delivery network, bumps/TSVs, power maps, and thermal boundary conditions without the need for process technology data 
• Graphical visualizations of IR drop, electromigration, and thermal maps to spot hotspots and power integrity risks instantly