The AI and HPC industries are advancing toward chiplet-based designs to achieve superior performance, as traditional monolithic SoCs face scaling challenges. Heterogeneous integration is driving semiconductor innovation but adds complexity to chip design, requiring advanced testing methodologies and improved Automated Test Equipment (ATE). Increasing test patterns and limited package pins demand high-bandwidth IOs, while advancements in ATE capabilities further necessitate optimized GPIOs to support higher-speed, efficient and low-cost testing.
Synopsys High-Speed Test IO IP is a cutting-edge IO interface solution that enables efficient, high-speed testing of complex semiconductor designs while minimizing hardware complexity and cost. It achieves this by supporting high data rates (up to 2.5Gbps) for testing, reusing limited package pins for multiple modes (serving as test ports during manufacturing, enabling high-speed clock observation during debugging, and functioning as GPIO during production), and eliminating the need for complex protocols or calibration sequences. This simplifies testing, reduces development time and costs, and ensures high test coverage and reliability for advanced AI, HPC, and chiplet-based designs.

Synopsys High-Speed Test IO Block Diagram
• High-Speed Data Transfer: Achieves data transfer rates of up to 2.5Gbps, for efficient testing during manufacturing
• Signal Integrity and Energy Efficiency: Maintains stable, high-speed performance while conserving energy with a low-power GPIO mode
• Simplified Testing Process: Protocol free solution, eliminates the need for initialization, calibration, and protocol support, streamlining hardware and software integration.
• Cost-Effective Design: Features a single-ended IO design that reduces area and cost without compromising performance
• Flexible Placement and Scalable Architecture: Modular design supports flexible IO placement and scalability for diverse chiplet-based SoC designs
• Multiplexed Functionality: Combines high-speed testing, clock observation, and GPIO functionality into a single, cost-effective interface
• Comprehensive Test Coverage: Supports BIST and Scan Test for thorough validation of complex semiconductor designs
| Description: | TSMC N3P 1.2V High-Speed Test IO |
| Name: | dwc_io_ts3p_cf_1p2v_hstio |
| Version: | 1.01a |
| ECCN: | 3E991/NLR |
| STARs: | Open and/or Closed STARs |
| myDesignWare: | Subscribe for Notifications |
| Product Type: | DesignWare IO |
| Documentation: | Contact Us for More Information |
| Download: | dwc_io_ts3p_cf_1p2v_hstio |
| Product Code: | J429-0 |
| Description: | TSMC N3P 1.2V IO Platform supporting cells with Additional Features |
| Name: | dwc_io_ts3p_cf_1p2v_basekit |
| Version: | 1.00a |
| ECCN: | 3E991/NLR |
| STARs: | Open and/or Closed STARs |
| myDesignWare: | Subscribe for Notifications |
| Product Type: | DesignWare IO |
| Documentation: | Contact Us for More Information |
| Download: | dwc_io_ts3p_cf_1p2v_basekit |
| Product Code: | J429-0 |