With soaring complexity and size of chips, achieving predictable design closure has become a challenge. A multitude of coding style, structural and electrical design issues can manifest themselves as design bugs and result in design iterations, or worst still—silicon re-spins. Other tools may detect design bugs but often at late stages of design implementation, after a significant investment in time and effort has already been made. As design teams become geographically dispersed, consistency and correctness of design intent becomes a key challenge for chip integration teams. Emphasis on design reuse and IP integration requires that design elements be integrated and meet guidelines for correctness and consistency.