With soaring complexity and size of chips, achieving predictable design closure has become a challenge. A multitude of coding style, structural and electrical design issues can manifest themselves as design bugs and result in design iterations, or worst still—silicon respins. Other tools may detect design bugs but often at late stages of design implementation, after a significant investment in time and effort has already been made. As design teams become geographically dispersed, consistency and correctness of design intent becomes a key challenge for chip integration teams. Emphasis on design reuse and IP integration requires that design elements be integrated and meet guidelines for correctness and consistency.