Why Attend?

Join Synopsys at AI Infra Summit 2027 to explore how we are enabling customers to rapidly innovate AI-powered products.

Synopsys supports AI chip development by providing advanced design tools, IP solutions, and verification technologies that enable faster, more efficient chip design. Our solutions help engineers optimize performance, power, and area for AI-specific applications. Synopsys also delivers a simulation-first path for Physical AI, to help teams train, test, and validate intelligent systems before deployment. 

Don’t miss these Synopsys sessions at AI Infra Summit to learn how to maximize your design innovation. 

Visit Our Booth

Tuesday, September 15: 10:00am – 6:00pm​ PT

Wednesday, September 16: 10:00am – 6:00pm​ PT

Thursday, September 17: 10:00am – 4:00pm​ PT

Synopsys Sessions

From Simulation to Deployment: Building the Engineering Stack That Powers Trusted Physical AI


Tuesday, September 15, 3:00 pm – 3:20 pm

Track: Physical AI

Anthony Matarazzo

Head of Physical AI GTM - Synopsys

The next generation of AI won’t live on screens – it will operate robots, autonomous systems, factories, vehicles, medical devices, and critical infrastructure. To succeed, these Physical AI systems must safely perceive, reason, and act in an unpredictable world. Traditional prototype-and-test approaches simply can’t keep pace with the speed, complexity, or scale required.

A simulation-first engineering stack changes the equation.

By combining AI-ready digital twins, high-fidelity multiphysics simulation, silicon-to-systems engineering, and physics-grounded synthetic data, organizations can generate trusted training data, expose edge cases before they become failures, and continuously validate AI models long before deployment.

This session explores how Synopsys and Ansys, now part of Synopsys, are bringing together trusted physics, electronics, embedded software, sensors, controls, and AI into a unified engineering platform that enables teams to design, train, validate, certify, and deploy Physical AI with unprecedented speed and confidence. 

Panel: Build a Winning AI Chip Startup from Scratch


Wednesday, September 16, 11:20am – 12:00pm

Track: Compute

 

Featured Panelists:

  • Andy Hock, Chief Strategy Officer, Cerebras

  • Robert Wachen, Co-founder & President, Etched

  • Usman Ali, Senior ASIC Engineer - Architecture, Meta

  • TBD

  • Moderated by: Sandeep Mehndiratta, Sr Vice President, AI Partnerships, Synopsys

Join chip design startup founders, VCs and leaders from the semiconductor ecosystem for an engaging discussion on whatit takes to build a chip design startup from the ground up. From idea incubation to securing seed funding, hiring the rightteam, identifying the best customer and market fit, to setting up a design environment, the panel will share their experiencesand insights on growing their companies from initial idea to first tapeout and beyond. Learn what it takes for a silicon startupto make it to unicorn status in the fastest growing industry of our era.​

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