Join Synopsys at AI Infra Summit 2026 to explore how we are enabling customers to rapidly innovate AI-powered products.
Don’t miss these Synopsys activities at AI Infra Summit to learn how to maximize your design innovation.
Stop by the Synopsys booth to connect with our experts, see demos across agentic AI, AI-powered design and engineering workflows, and discuss how Synopsys solutions help teams accelerate silicon-to-systems innovation with greater confidence, scalability, and speed.
Tuesday, September 15: 10:00am – 6:00pm PT
Wednesday, September 16: 10:00am – 6:00pm PT
Thursday, September 17: 10:00am – 4:00pm PT
Take a break from the sessions, enjoy a mid-afternoon treat, and connect with semiconductor and AI leaders in the Synopsys booth on September 15th &16th from 3:00pm-4:00pm.
The next generation of AI won’t live on screens – it will operate robots, autonomous systems, factories, vehicles, medical devices, and critical infrastructure. To succeed, these Physical AI systems must safely perceive, reason, and act in an unpredictable world. Traditional prototype-and-test approaches simply can’t keep pace with the speed, complexity, or scale required.
A simulation-first engineering stack changes the equation.
By combining AI-ready digital twins, high-fidelity multiphysics simulation, silicon-to-systems engineering, and physics-grounded synthetic data, organizations can generate trusted training data, expose edge cases before they become failures, and continuously validate AI models long before deployment.
This session explores how Synopsys and Ansys, now part of Synopsys, are bringing together trusted physics, electronics, embedded software, sensors, controls, and AI into a unified engineering platform that enables teams to design, train, validate, certify, and deploy Physical AI with unprecedented speed and confidence.
Moderated by: Sandeep Mehndiratta, Senior Vice President of AI Partnerships, Synopsys
Wednesday, September 16, 11:20am – 12:00pm
Track: Compute
Join chip design startup founders, VCs and leaders from the semiconductor ecosystem for an engaging discussion on whatit takes to build a chip design startup from the ground up. From idea incubation to securing seed funding, hiring the rightteam, identifying the best customer and market fit, to setting up a design environment, the panel will share their experiencesand insights on growing their companies from initial idea to first tapeout and beyond. Learn what it takes for a silicon startupto make it to unicorn status in the fastest growing industry of our era.
Discover how Synopsys' AI agents can transform engineering workflows, boost productivity, and accelerate complex design and verification tasks.
Learn how simulation, digital twins, and real-world data are powering the next generation of intelligent physical systems.
See how Synopsys' flexible, cloud-based EDA infrastructure enables engineering teams and startups to scale compute resources efficiently and accelerate time-to-results.
Put your driving skills to the test in the immersive Formula 1 simulator experience and see how advanced computational fluid dynamics helps optimize real-world racing performance.
See Synopsys 224G IP enabling the foundation for next-generation AI infrastructure, supporting emerging scale-up and scale-out architectures, including UALink, ESUN, Ultra Ethernet, and 1.6T networking, showcasing robust performance over extra long-reach connectivity.
This demo can be seen in the UALink Consortium booth (#737).