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Multiphysics Fusion Technology for Multi-Die Designs Explained
Multiphysics Fusion Technology for Multi-Die Designs Explained

Unified multiphysics fusion helps multi-die teams validate earlier and sign off faster.

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Why Attend?

Synopsys is pleased to join 2026 TSMC OIP as a Platinum Sponsor. 

As a long‑standing TSMC ecosystem partner, we will be showcasing our latest design‑enablement technologies and silicon‑proven IP optimized for TSMC’s A16, A14, and N2P nodes and advanced packaging technologies.

We invite all attendees to visit Synopsys booth #<TBD> to explore our demos and network with our experts.

 

In-Person & Virtual Presentations & Posters | North America

In-Person Presentations: 

  • Multiphysics-Aware Timing Signoff for AI and HPC Designs
  • Methodology for Fmax-per-Watt Scaling in CPU-Centric Designs Using Advanced EDA and DTCO Techniques
  • Addressing Inter-Die STA Complexity for 3D Multi-Die Designs
  • Automated Architecture-Phase PDN Prototyping Workflow
  • Scaling AI Data Center Infrastructure Through Protocol-Agnostic Physical Design for Scale-Up Using 224G SerDes

Virtual Presentations:

  • Improve Performance, OCV Robustness, and Ease of Use with Flat-First H-Treee Insertion Flow for HPC Hierarchical Designs
  • Silicon Results: TSMC CoWoS Interposer design with Synopsys SLM IP for Multi-Die Monitor, Test, and Repair
  • Unlocking additional PPA gains on TSMC N2P Processes through AI-driven Metal Scheme Exploration
  • AI-Driven Multi-Parameters Multi-Objectives Automatic Optimization For Transmission Line In High-Speed SerDes IP
  • Optimal 3DIC Multiphysics Signoff with Timing, Power, and Thermal Convergence
  • TSMC COUPE photonic integrated circuit co-design with custom verilog-A and PDK TMI models

 

Synopsys In-Person Booth

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Synopsys Booth #xxx

View the latest innovative technologies and chat with Synopsys experts live! 

EDA Flows Ready for Angstrom‑Scale Node:
Discover Synopsys’ AI-powered digital, analog and verification flows with multiphysics analysis, including production‑ready flows for TSMC A14, and certified flows for TSMC A16 and N2P designed for superior PPA and predictable closure.

Live demonstrations:
Stop by Booth #<TBD> for hands‑on demonstrations showcasing Synopsys’ leadership. We will be showcasing Agentic AI covering a series of our agents across verification, analog and implementation. 

There will be additional demos covering TBD IP in TSMC’s advanced process nodes demonstrating robust interoperability and excellent performance across respective channels.

Connect With Us: 
Whether you are focused on high‑performance compute, AI acceleration, hyperscale infrastructure, mobile, or automotive silicon, Synopsys experts will be available to discuss design strategies and solutions that help you accelerate development on TSMC’s most advanced technologies.

We look forward to connecting with you at the Synopsys booth #TBD. 

TSMC OIP Worldwide Events

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