Join Synopsys at the TSMC OIP Forum 2023 in multiple locations around the globe.  Synopsys and TSMC have been collaborating to ensure customer success.  We will have 16 in-person and online presentations.  Register today! 

Synopsys In-Person Presentations | North America

In-Person Presentations: 

On-Line Presentations: 



Why Attend?

Learn from OIP partners how to leverage their technology for your design challenges: 
  • Emerging advanced node design challenges and corresponding design flows and methodologies for N2, N3/N3E/N3P/N3AE, N4/N4P, N5/N5A, N6/N6e/N6RF/N7, N12e, and N22
  • Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications
  • Comprehensive design solutions for specialty technologies enabling ultra-low power, ultra-low voltage, analog migration, RF, mmWave, and automotive designs targeting 5G, automotive, and IoT designs
  • Ecosystem specific TSMC reference flow implementations, P&R optimization, machine learn-ing to improve design quality and productivity, and cloud-based design solutions
  • Successful , real-life applications of design technologies and IP solutions from TSMC's Open Innovation Platform® Ecosystem members and TSMC customers to speed up time-to-design and time-to-market

TSMC OIP Worldwide Events

Synopsys In-Person & Virtual Booth

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Synopsys Booth #408

TSMC attendees are invited to visit the Synopsys booth to view the latest innovative technologies and chat with Synopsys experts live! 

Booth topics include:

  • Synopsys IP
  • Fusion Design Family
  • Design Signoff
  • Unlock the Transformative Power of Artificial Intelligence
  • Analog Design Tools
  • Accelerate Physical Verification Closure
  • Silicon Lifecycle Management
  • Automotive Solutions - Design the future of automotive with Synopsys