Why Attend?

Discover how Synopsys and Ansys together empower government, aerospace, and defense organizations and their partners to achieve mission success. Learn how our engineering solutions accelerate innovation and deliver robust results for your most critical applications. Experience the force multiplier effect of Synopsys and Ansys, enabling your teams with engineering solutions from silicon to systems.

Title Date/Time Location

Session 3: Chiplets

3.2 Enabling System Innovation with Multi-Die Designs: Trends, Challenges, and Solution

Tuesday, March 10

1:30–3:10 PM

Room: 293

Session 6: Superconducting Electronics Design and Architecture Constructs

6.1 SuperMOS: Combining Superconducting and CMOS Integrated Circuits

6.2 Advancements to Josephson Junction Modeling in Circuit Simulation

Tuesday, March 10

1:30–3:10 PM

Room: 296

Session 15: Design for 3DIC

15.4 Multi-scale Thermal and Physics Modeling for Defense Electronics: From Atomistic Simulation to System-Level Reliability

Wednesday, March 11

8:20–10:00 AM

Room: 293

Session 17: Advanced Digital Design

Chair: Vipul Patel, Government Initiatives, Synopsys

17.3 Advancements in Embedded Memory: Leveraging Intel 18A Process with RibbonFET and PowerVia Technologies

Wednesday, March 11

8:20-10:00 AM  

Room: 295

Session 18: Quantum Architecture and Design

18.1  Crosstalk Simulation in Superconducting Transmon Design for Utility-Scale Quantum Computing

18.4 Atomistic Modeling of Piezoelectric Properties of the Si-Al Interface

Wednesday, March 11

8:20-10:00 AM

Room: 296 

Session 21: Heterogeneous Integration Technologies

21.5: Advanced Packaging EDA Challenges - Solutions Applied in the DARPA NGMM Program

Wednesday, March 11

10:30 AM-12:10 PM

Room: 293

Session 29: Approaches to Advanced Designs on Intel 18A Technology

29.2 Scalable Multi-Die Design for Aerospace & Government, Using UCIe IP on Intel 18A

Wednesday, March 11

1:30-3:10 PM

Room: 295
Session 32: Fuzzing Techniques for Security Verification

Wednesday, March 11

3:30-5:10 PM

291-292

Session 33: On-Shore Packaging

33.1 SHIELD USA: Leap-ahead Organic Substrate Enabled by Fan-Out Technology, Domestic Materials, Process Innovations, and Novel EDA Workflows

Wednesday, March 11

3:30-5:10 PM 

Room: 293

Session 34: AI for Design

34.2 Predictive Nanoscale Simulations for THz Regime

 

Wednesday, March 11
3:30-5:10 PM

Room: 294

Session 41: Radiation Hardened by Design

41.1 Statistical Analysis of Architectural Vulnerability Factor for Soft Errors

Thursday, March 12
8:20-10:00 AM
Room: 295

Session 44: RF Simulation, Modeling, & Design

44.1 Mission to Microelectronics: Mission-driven Design and Advanced Verification Using Digital Engineering

Thursday, March 12
1:30-3:10 PM
Room: 293

Let's Have a Conversation!

Contact us to reserve a slot in our on-site meeting rooms during GOMACTech. Get answers to your most challenging questions, and explore how we can help you achieve success.

Title Date/Time Location

Poster Session: Power Electronics and Emerging Power Technologies Posters

P.57 TCAD Electrothermal Simulations to Gain Insights into Temperature-Dependent Physics in GaN HEMTs

Thursday, March 12

10:30 AM–12:00 PM

Exhibit Hall

Poster Session: AI and ML in Microelectronics Posters

P.9 A Leap Forward in Formal Verification Using Generative AI

P.23 AI-Driven Digital IC Design Optimization in Aerospace and Defense Applications

Thusrday, March 12

10:30 AM–12:00 PM

Exhibit Hall

Poster Session: Emerging Technologies Posters

P.25 Ternary-valued Associative Processor Design

P.26 A Novel Full Adder Design Using Hybrid Memristor Ratioed Logic XOR

P.28 Applying Automotive System Development Best Practices to Aerospace Applications

Thursday, March 12

10:30 AM-12:00 PM  

Exhibit Hall

Poster Session: Emerging Technologies Posters: Issues with Obsolescence in Microelectronics

P.30 Mitigating System-Level Obsolescence in Long-Life Electronics with AI-Driven Modernization

Thursday, March 12

10:30 AM-12:00 PM

Exhbit Hall 

Workshops & Additional Demos

Title Date/Time Location

Workshop: Building Trust from Edge to Cloud: Synopsys ARC-V Processor IP and the RISC-V Security Advantage​

As defense and aerospace systems become more distributed and software‑defined, trust must be designed into computingplatforms from the outset. This session explores how Synopsys ARC‑V processor IP and the RISC‑V security advantageenable resilient, verifiable compute platforms aligned with mission‑critical assurance needs.

Wednesday, March 11

7:45 AM–8:15 AM

Synopsys Meeting Room #274

Workshop: From Design to Deployment: Securing the Mission (Synopsys & Intel)​

Intel Foundry and Synopsys are collaborating to enable more trusted, resilient, and high-performance microelectronics for defense applications. Join us to learn about: Intel technologies for defense missions, including the Intel 18A family and 3D advanced packaging solutions such as EMIB-T and Foveros. Synopsys solutions optimized for Intel Foundry technologies, including 3DIC Complier and UCIe IP.

Wednesday, March 11

12:00 PM–1:30 PM

Intel Meeting Room #278

Workshop: Securing Mission-Critical Systems: Integrity, Traceability, and Quantum-Safe Solutions for Defense Applications ​

Defense organizations and contractors today face escalating cyber threats, supply chain risks, and the urgent need toprepare for quantum-era security challenges.  This presentation explores approaches for safeguarding sensitiveinfrastructure and addressing evolving security risks in defense environments. 

Thursday, March 12

7:45 AM-8:15 PM  

Synopsys Meeting Room #274
Demo: Use Synopsys ZeBu in NIMBIS ITAR Cloud to Accelerate SW Development with Real OS

Tuesday, March 10

12:00 PM-8:00 PM

Wednesday, March 11

9:00 AM-4:00 PM

Visit NIMBIS Services booth #228 to see the demo
Demo: Helios Memory Guard and Synopsys ARC-V RPX Space Invaders Demo

Tuesday, March 10

12:00 PM-8:00 PM

Wednesday, March 11

9:00 AM-4:00 PM

Visit Idaho Scientific booth #407 to see the live demo

Exhibits

Visit Synopsys booth 220 to network with our experts, see technical demonstrations, including digital engineering, digital twins, 3D heterogeneous integration, and multiphysics analysis.
  • Tuesday, March 10, 2026 | 12:00 pm - 8:00 pm
  • Wednesday, March 11, 2026 | 9:00 am - 4:00 pm

 

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