Discover how Synopsys and Ansys together empower government, aerospace, and defense organizations and their partners to achieve mission success. Learn how our engineering solutions accelerate innovation and deliver robust results for your most critical applications. Experience the force multiplier effect of Synopsys and Ansys, enabling your teams with engineering solutions from silicon to systems.
| Title | Date/Time | Location |
Session 3: Chiplets 3.2 Enabling System Innovation with Multi-Die Designs: Trends, Challenges, and Solution |
Tuesday, March 10 1:30–3:10 PM |
Room: 293 |
Session 6: Superconducting Electronics Design and Architecture Constructs 6.1 SuperMOS: Combining Superconducting and CMOS Integrated Circuits 6.2 Advancements to Josephson Junction Modeling in Circuit Simulation |
Tuesday, March 10 1:30–3:10 PM |
Room: 296 |
Session 15: Design for 3DIC 15.4 Multi-scale Thermal and Physics Modeling for Defense Electronics: From Atomistic Simulation to System-Level Reliability |
Wednesday, March 11 8:20–10:00 AM |
Room: 293 |
Session 17: Advanced Digital Design Chair: Vipul Patel, Government Initiatives, Synopsys 17.3 Advancements in Embedded Memory: Leveraging Intel 18A Process with RibbonFET and PowerVia Technologies |
Wednesday, March 11 8:20-10:00 AM |
Room: 295 |
Session 18: Quantum Architecture and Design 18.1 Crosstalk Simulation in Superconducting Transmon Design for Utility-Scale Quantum Computing 18.4 Atomistic Modeling of Piezoelectric Properties of the Si-Al Interface |
Wednesday, March 11 8:20-10:00 AM |
Room: 296 |
Session 21: Heterogeneous Integration Technologies 21.5: Advanced Packaging EDA Challenges - Solutions Applied in the DARPA NGMM Program |
Wednesday, March 11 10:30 AM-12:10 PM |
Room: 293 |
Session 29: Approaches to Advanced Designs on Intel 18A Technology 29.2 Scalable Multi-Die Design for Aerospace & Government, Using UCIe IP on Intel 18A |
Wednesday, March 11 1:30-3:10 PM |
Room: 295 |
| Session 32: Fuzzing Techniques for Security Verification | Wednesday, March 11 3:30-5:10 PM |
291-292 |
Session 33: On-Shore Packaging 33.1 SHIELD USA: Leap-ahead Organic Substrate Enabled by Fan-Out Technology, Domestic Materials, Process Innovations, and Novel EDA Workflows |
Wednesday, March 11 3:30-5:10 PM |
Room: 293 |
Session 34: AI for Design 34.2 Predictive Nanoscale Simulations for THz Regime |
Wednesday, March 11 |
Room: 294 |
Session 41: Radiation Hardened by Design 41.1 Statistical Analysis of Architectural Vulnerability Factor for Soft Errors |
Thursday, March 12 8:20-10:00 AM |
Room: 295 |
Session 44: RF Simulation, Modeling, & Design 44.1 Mission to Microelectronics: Mission-driven Design and Advanced Verification Using Digital Engineering |
Thursday, March 12 1:30-3:10 PM |
Room: 293 |
Contact us to reserve a slot in our on-site meeting rooms during GOMACTech. Get answers to your most challenging questions, and explore how we can help you achieve success.
| Title | Date/Time | Location |
Poster Session: Power Electronics and Emerging Power Technologies Posters P.57 TCAD Electrothermal Simulations to Gain Insights into Temperature-Dependent Physics in GaN HEMTs |
Thursday, March 12 10:30 AM–12:00 PM |
Exhibit Hall |
Poster Session: AI and ML in Microelectronics Posters P.9 A Leap Forward in Formal Verification Using Generative AI P.23 AI-Driven Digital IC Design Optimization in Aerospace and Defense Applications |
Thusrday, March 12 10:30 AM–12:00 PM |
Exhibit Hall |
Poster Session: Emerging Technologies Posters P.25 Ternary-valued Associative Processor Design P.26 A Novel Full Adder Design Using Hybrid Memristor Ratioed Logic XOR P.28 Applying Automotive System Development Best Practices to Aerospace Applications |
Thursday, March 12 10:30 AM-12:00 PM |
Exhibit Hall |
Poster Session: Emerging Technologies Posters: Issues with Obsolescence in Microelectronics P.30 Mitigating System-Level Obsolescence in Long-Life Electronics with AI-Driven Modernization |
Thursday, March 12 10:30 AM-12:00 PM |
Exhbit Hall |