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Synopsys at the 2026 TSMC Technology Symposium
Proud Platinum Sponsor
Synopsys is pleased to join the 2026 TSMC Technology Symposium as a Platinum Sponsor.
As a long‑standing TSMC ecosystem partner, we will be showcasing our latest design‑enablement technologies and silicon‑proven IP optimized for TSMC’s A14, A16, and N2P nodes and advanced packaging technologies.
We invite all attendees to visit Synopsys booth #302 to explore our demos and network with our experts.
Synopsys Booth #302
Powering The Next Generation AI Systems
Advanced Silicon IP for High‑Performance SoCs
Explore Synopsys’ broad portfolio of Foundation, Interface and Security IP, delivering the lowest power on TSMC’s N2/N2P nodes.
Learn how our silicon-proven, best-in-class IP can enable first-pass silicon success while meeting power, performance and area requirements using TSMC's latest nodes.
3D Multi‑Die Design
Learn how Synopsys enables advanced multi‑die designs through support for TSMC’s 3DFabric technology including SoIC and CoWoS, from early architecture to manufacturing.
EDA Flows Ready for Angstrom‑Scale Nodes
Discover Synopsys’ AI-powered digital, analog and verification flows with multiphysics analysis, including production‑ready flows for TSMC A14, and certified flows for TSMC A16 and N2P designed for superior PPA and predictable closure.
Live Technology Demos
Stop by Booth #302 for hands‑on demonstrations showcasing Synopsys’ leadership in high‑speed connectivity. We will be showcasing silicon-proven PCIe 7.0 and 224G IP in TSMC’s advanced process nodes demonstrating robust interoperability and excellent performance across respective channels.
Connect With Us
Whether you are focused on high‑performance compute, AI acceleration, hyperscale infrastructure, mobile, or automotive silicon, Synopsys experts will be available to discuss design strategies and solutions that help you accelerate development on TSMC’s most advanced technologies. We look forward to connecting with you at the Synopsys booth #302.
