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2023 论文集
2023 论文集
Presentations
基于Redhawk-SC Fusion的IR driven Placement帮助芯片实现IR-Drop Signoff
Synopsys FUSA 流程帮助客户实现车规项目快速收敛
利用Fusion Compiler和DSO.ai优势叠加，为高性能ARM CPU获取最大性能和设计生产力
ZeBu Server 5——业界最快的超大规模硬件仿真系统
一个高效的外部Memory Die的测试方案，以及基于HPC芯片应用的案例分析
Fusion+DSO.ai+DesignDash打造芯片数字孪生，AI助力RISC-V内核5nm大数据加速4nm设计
VC SpyGlass层次化流程加速DPU大芯片的CDC和RDC验证收敛效率
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