BLOG Dec 04, 2025/4 min read BLOG 3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months By Shekhar Kapoor Tags: Multi-Die, RTL Synthesis, AI & Machine Learning, Test, 3DIC Design, About Synopsys, Physical Implementation, Interface IP, Foundation IP, Signoff, Customer Spotlight, Cloud, Silicon Lifecycle Management, Signal & Power Integrity, Design, Fusion Design Platform, 5nm and Below, HPC, Data Center, Silicon IP, Verification
BLOG Dec 02, 2025/4 min read BLOG New Fujitsu Chip to Power Greener, Smarter Data Centers By Greg Sorber Tags: Multi-Die, Debug, Simulation, 3DIC Design, Emulation, About Synopsys, Energy-Efficient SoCs, Customer Spotlight, Data Center, Design, 5nm and Below, HPC, Data Center, Verification
BLOG Nov 25, 2025/3 min read BLOG Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines By Andrew Appleby, Daryl Seitzer Tags: Data Center, Fusion Technology, Design, Fusion Design Platform, About Synopsys, 5nm and Below, Energy-Efficient SoCs, Foundation IP, HPC, Data Center, Silicon IP
BLOG Sep 11, 2025/3 min read BLOG What Is Local Layout Effect (LLE) and How Does It Impact Chip Design? By Chun-Soo Kim, Hoseong Kim Tags: Design, About Synopsys, Physical Implementation, 5nm and Below, Energy-Efficient SoCs, Signoff, Verification
BLOG Apr 22, 2024/6 min read BLOG What You Need to Know About Gate-All-Around Designs By Andrew Appleby Tags: Design, About Synopsys, 5nm and Below, Silicon IP
BLOG Nov 15, 2023/7 min read BLOG How Will Angstrom-Scale Chips Advance the Electronics Industry? By Deepak Sherlekar, Rob Aitken Tags: AI & Machine Learning, Design, About Synopsys, 5nm and Below, Automotive, HPC, Data Center