Discover Synopsys Insights Shared at SPIE Advanced Lithography + Patterning 2025

  • The Exploration of Curvilinear Mask Manufacturability and Wafer Printability
  • Beyond design-rule testpattern coverage for low-K1 hotspot and process variability reduction
  • Metaatom Choice Considering Process Variation
  • Full Field Stitching-Aware High-NA EUV OPC/RET Flow
  • Exploring Block-level PPA Improvements Using SuperVia: Implementation and Analysis in a 2nm Process
  • Mitigating Stitching-Induced Performance and Yield Losses in High-NA EUV Lithography: Place and Route Implementation Approaches
  • Automated Identification of Repeated Chip Layout Patterns
  • An Innovative Stitching Solution for Multi-Patterning Compliant
  • Routing Metal layers beyond 2nm

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