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Discover Synopsys Insights Shared at SPIE Advanced Lithography + Patterning 2025
- The Exploration of Curvilinear Mask Manufacturability and Wafer Printability
- Beyond design-rule testpattern coverage for low-K1 hotspot and process variability reduction
- Metaatom Choice Considering Process Variation
- Full Field Stitching-Aware High-NA EUV OPC/RET Flow
- Exploring Block-level PPA Improvements Using SuperVia: Implementation and Analysis in a 2nm Process
- Mitigating Stitching-Induced Performance and Yield Losses in High-NA EUV Lithography: Place and Route Implementation Approaches
- Automated Identification of Repeated Chip Layout Patterns
- An Innovative Stitching Solution for Multi-Patterning Compliant
- Routing Metal layers beyond 2nm
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