Design Automation Conference 2026

This demo showcases how agentic AI teams are transforming chip design by orchestrating end-to-end EDA workflows with greater autonomy as design complexity grows. Rather than a single assistant, a coordinated team of specialized agents plans, decides, and executes multi-step tasks—splitting work across roles (e.g., design, verification, constraints, and debug), invoking the right tools, running iterative loops, interpreting results, and collaborating to meet user-defined goals such as coverage closure and PPA targets. You'll see agent teams coordinate activities like RTL and constraint generation, lint/CDC and formal-driven refinement, verification planning and test creation, and automated debug/RCA to converge faster with fewer late surprises. These demos illustrate how Synopsys' agentic AI teams can re-engineer traditional design flows into goal-driven, self-optimizing workflows that boost productivity and accelerate innovation.

Integrated Synopsys–Ansys design solutions remove pervasive physics bottlenecks to accelerate next-generation AI and heterogeneous chip innovation. The Multiphysics Fusion portfolio combines Synopsys' AI-powered design platforms with Ansys signoff-grade multiphysics analysis across timing signoff, design closure, multi-die design, and AMS workflows, enabling multiphysics-aware intelligence at every stage for advanced-node designs operating at lower voltages and higher current densities.

As multi-die complexity becomes a system-level challenge, silicon must be optimized in the context of the full application—from package and interconnect to power, thermal, and workload behavior. Multiphysics Fusion unifies these workflows to expose coupled effects earlier, improve correlation to signoff, and reduce costly design iterations.

At DAC, Synopsys will demonstrate multiphysics-driven workflows across 3DIC, digital, and photonics. In 3DIC Compiler, you'll see an end-to-end HBM routing and analysis flow with HBM prototyping, cross-sectional analysis (insertion loss, crosstalk, eye diagrams), HBM auto-routing, electromagnetic extraction, and AI-driven optimization to hit performance targets—plus a multi-die PG bump optimization flow with PG prototyping, early PG DRC, full-stack EMIR heat maps, and AI/ML-driven bump optimization for power integrity and reliability. For custom photonics, the demo spans PCell layout in OptoCompiler, physics-aware simulation with Lumerical device tools, automated photonic Verilog-A generation via Lumerical CML Compiler for PrimeSim (with photonic and electronic foundry PDKs), and electro-optic co-simulation in PrimeSim launched directly from OptoCompiler. Finally, the demo brings multiphysics into digital closure: Multiphysics Fusion integrates incremental in-design IR and thermal analysis into timing and optimization loops to prevent late-stage surprises, while Multiphysics Timing Signoff in PrimeTime delivers IR- and thermal-aware signoff timing that reflects true silicon behavior under real operating conditions.

This demo showcases a unified multiphysics simulation and analysis portfolio for next-generation electronic systems, spanning chip, package, and board. It highlights multiphysics analysis of high data-rate links, including P-EM RF Channel Modeler for signal-integrity and channel characterization, and 3D simulation of advanced IC systems to capture coupled electromagnetic, thermal, and reliability effects. You'll also see multiphysics simulation solutions for printed circuit board design and reliability, connecting PCB layout decisions to performance and lifetime outcomes. Finally, the demo demonstrates scalable data processing systems that manage large simulation datasets and accelerate post-processing and insight, enabling faster iteration and higher-confidence correlation across complex high-speed designs.