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Spotlight

Engineering for the Exponential Complexity of Physical AI

Jan 28, 2026 / 4 min read

Engineering for the Exponential Complexity of Physical AI

By Greg Sorber

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About Synopsys,
Executive Voices,
AI & Machine Learning,
Automotive,
Consumer,
Design,
Verification

Jan 20, 2026 / 4 min read

Register Now: Synopsys Converge 2026 Unites Silicon and Systems Communities to Re-Engineer the Future

By Rob van Blommestein

Tags: About Synopsys , AI & Machine Learning , HPC, Data Center , Multi-Die , Design , Silicon IP , Verification

Jan 13, 2026 / 5 min read

Synopsys Bold Prediction: Force Fields Will Accelerate Atomistic Simulations by 10,000× in 2026, Unlocking New Era of Discovery

By Anders Blom, Igor Markov

Tags: About Synopsys , AI & Machine Learning , Quantum Computing , Manufacturing , Atomic Scale Modeling , Atomistic Simulation Software

Dec 18, 2025 / 5 min read

Synopsys Bold Prediction: New Cars Will Contain 600 Million Lines of Code by 2027

By Tom De Schutter, Marc Serughetti

Tags: About Synopsys , Executive Voices , Automotive , Design

Dec 04, 2025 / 4 min read

3D Chips: Socionext Achieves Two Successful Tape-Outs in Just Seven Months

By Shekhar Kapoor

Tags: About Synopsys , Customer Spotlight , AI & Machine Learning , Cloud , HPC, Data Center , Multi-Die , Silicon Lifecycle Management , Design , Silicon IP , Verification , 5nm and Below , Fusion Design Platform , Physical Implementation , RTL Synthesis , Signal & Power Integrity , Signoff , Test , Foundation IP , Interface IP , 3DIC Design

Jan 22, 2026 / 4 min read

From Concept to Tape-Out: SiMa.ai Achieves Bug-Free A0 Silicon for Physical AI

By Greg Sorber

Tags: About Synopsys , Customer Spotlight , AI & Machine Learning , Energy-Efficient SoCs , HPC, Data Center , Design , Silicon IP , Verification , Fusion Design Platform , Prototyping , RTL Synthesis , Signal & Power Integrity , Signoff , Interface IP , Processor Solutions , Emulation , Formal Verification , Physical Implementation , Physical Verification

Nov 06, 2025 / 5 min read

10 Tips for First-Pass Silicon Success in AI Chip Development

By Frank Schirrmeister, Rita Horner, Todd Koelling

Tags: About Synopsys , Engineering Central , AI & Machine Learning , HPC, Data Center , Multi-Die , Silicon Lifecycle Management , Design , Silicon IP , Verification , Physical Implementation , Signoff , Test , Emulation , Virtual Prototyping

Nov 25, 2025 / 3 min read

Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines

By Andrew Appleby, Daryl Seitzer

Tags: About Synopsys , Data Center , Energy-Efficient SoCs , HPC, Data Center , Design , Silicon IP , 5nm and Below , Fusion Design Platform , Fusion Technology , Foundation IP

Jul 17, 2025 / 4 min read

Synopsys and Ansys Are Now United: Together, We Will Ignite Innovation from Silicon to Systems

By Sassine Ghazi

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Innovate Faster with Synopsys Multi-Die Solution

Explore our eBook for scalable multi-die solutions to boost innovation, productivity, and success.

Automotive Executive Guide: Rethinking Automotive Development

A guide to virtualization in software-defined vehicles for automotive leaders.

Mastering AI Chip Complexity

This eBook explores AI chip design trends, challenges, and strategies for first-pass silicon success.

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Spotlight

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This eBook explores AI chip design trends, challenges,
and strategies for first-pass silicon success.