Cloud native EDA tools & pre-optimized hardware platforms
Universal Chiplet Interconnect Express (UCIe), is a standard designed to facilitate high-bandwidth communication between heterogeneous chiplets, in a single package. As the semiconductor industry continues to push the boundaries of performance, power efficiency, and cost-effectiveness, UCIe emerges as a critical die-to-die technology for achieving these goals.
By providing a standardized interface, UCIe enables seamless interoperability between chiplets from different vendors, thereby advancing a more modular and scalable approach to multi-die design.
Figure 1: Companies join forces to establish a complete standardized die-to-die interconnect (Source: www.uciexpress.org)
UCIe operates by defining a comprehensive set of protocols and physical layer specifications that govern the communication between chiplets. This standard ensures that data can be transmitted at high speeds with minimal latency and power consumption. The key components of UCIe include:
Figure 2: The UCIe specification layering
UCIe's modular architecture allows for easy integration and scalability, making it an ideal solution for a wide range of applications, from high-performance computing to consumer electronics.
Understanding Density, Testing, and Performance in UCIe Packaging
UCIe offers a multitude of benefits that make it an attractive choice for multi-die designs. Here are some of the key advantages:
Synopsys offers a complete UCIe IP solution that includes the controller, PHY, and verification IP. Our UCIe IP operates at 40Gbps per pin while remaining fully compliant with the UCIe specification. This comprehensive solution ensures that designers can seamlessly integrate UCIe into their chip designs, achieving high performance and efficiency.
Synopsys' UCIe IP solutions are designed to meet the highest standards of quality and reliability. By leveraging our extensive expertise in semiconductor design and verification, we provide our customers with the tools they need to succeed in the rapidly evolving landscape of multi-die designs.
High-Quality IP Solution for Fast and Reliable Die-to-Die Connectivity